A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
High-reliability aluminum nitride copper-coated ceramic substrate and preparation method thereof
According to the high-reliability aluminum nitride copper-coated ceramic substrate and the preparation method thereof, in order to achieve advantage complementation of all single-phase materials, aluminum nitride powder, silicon nitride powder and a sintering aid are used as main materials, the composite aluminum nitride ceramic substrate is prepared through sintering, the requirements for high strength, high heat conduction, low loss and the like are met, the comprehensive performance is excellent, and the application prospect is wide. And the practicability is good. The process is reasonable in design, the scheme is easy to operate, the interface wettability between A1N and metal Cu can be effectively improved due to the existence of the ceramic slurry layer and the solder layer, aluminum nitride and the copper sheet are tightly combined, the copper-clad substrate has the advantages of being high in peel strength and reliability, the method can be suitable for preparing semiconductor coolers and power semiconductor modules, and the application range is wide. Particularly, the LED lamp has high practicability for large-scale and super-large-scale integrated circuits and high-power LEDs.
本发明公开了一种高可靠性氮化铝覆铜陶瓷基板及其制备方法，为实现各个单相材料的优势互补，本申请以氮化铝粉末、氮化硅粉末、烧结助剂为主料，烧结制备复合氮化铝陶瓷基板，其满足高强度、高导热、低损耗等要求，综合性能优异，实用性较好。本发明工艺设计合理，方案操作简单，陶瓷浆料层和焊料层的存在能够有效改善A1N与金属Cu之间的界面润湿性，使氮化铝与铜片之间紧密结合，使得覆铜基板具有高剥离强度及高可靠性优点，可适用于半导体制冷器、功率半导体模块的制备，特别是大规模、超大规模集成电路及大功率LED，具有较高的实用性。
High-reliability aluminum nitride copper-coated ceramic substrate and preparation method thereof
According to the high-reliability aluminum nitride copper-coated ceramic substrate and the preparation method thereof, in order to achieve advantage complementation of all single-phase materials, aluminum nitride powder, silicon nitride powder and a sintering aid are used as main materials, the composite aluminum nitride ceramic substrate is prepared through sintering, the requirements for high strength, high heat conduction, low loss and the like are met, the comprehensive performance is excellent, and the application prospect is wide. And the practicability is good. The process is reasonable in design, the scheme is easy to operate, the interface wettability between A1N and metal Cu can be effectively improved due to the existence of the ceramic slurry layer and the solder layer, aluminum nitride and the copper sheet are tightly combined, the copper-clad substrate has the advantages of being high in peel strength and reliability, the method can be suitable for preparing semiconductor coolers and power semiconductor modules, and the application range is wide. Particularly, the LED lamp has high practicability for large-scale and super-large-scale integrated circuits and high-power LEDs.
本发明公开了一种高可靠性氮化铝覆铜陶瓷基板及其制备方法，为实现各个单相材料的优势互补，本申请以氮化铝粉末、氮化硅粉末、烧结助剂为主料，烧结制备复合氮化铝陶瓷基板，其满足高强度、高导热、低损耗等要求，综合性能优异，实用性较好。本发明工艺设计合理，方案操作简单，陶瓷浆料层和焊料层的存在能够有效改善A1N与金属Cu之间的界面润湿性，使氮化铝与铜片之间紧密结合，使得覆铜基板具有高剥离强度及高可靠性优点，可适用于半导体制冷器、功率半导体模块的制备，特别是大规模、超大规模集成电路及大功率LED，具有较高的实用性。
High-reliability aluminum nitride copper-coated ceramic substrate and preparation method thereof
一种高可靠性氮化铝覆铜陶瓷基板及其制备方法
YU XIAODONG (author) / LIU XIAOHUI (author) / YANG KAI (author)
2022-05-13
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
Preparation method of coated aluminum nitride powder and prepared aluminum nitride ceramic substrate
| European Patent Office | 2021
Aluminum nitride ceramic substrate and preparation method thereof
| European Patent Office | 2020
Aluminum nitride ceramic substrate and preparation method thereof
| European Patent Office | 2023
Aluminum nitride ceramic substrate and preparation method thereof
| European Patent Office | 2024
| European Patent Office | 2021