A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Novel ceramic tile paving micro-crack leveling process
The invention discloses a novel ceramic tile paving and pasting micro-crack leveling process which comprises the following steps: S1, paving and pasting a first ceramic tile, and vertically inserting a PVC card along the adjacent side of the first ceramic tile; s2, after the PVC card is inserted, a second ceramic tile is laid, and the second ceramic tile is adjacent to the first ceramic tile; s3, the surfaces of the ceramic tiles are manually flapped to preliminarily adjust the flatness; s4, the leveler is used for conducting secondary adjustment and flattening on the surface of the ceramic tile; s5, covering two sides of a gap between the adjacent ceramic tiles with ceramic chips for flatness fixation, and smearing glue on two sides of the front surfaces of the ceramic chips; and S6, after the tile fixing glue is air-dried, the small tiles are knocked open from the side faces of the tiles through a wood hammer, then the glue is cleaned, and then the joint filling procedure can be carried out. The effects of being suitable for laying of the tiles with small joints, improving the leveling efficiency, facilitating disassembly and the like can be effectively achieved.
本发明公开了一种新型瓷砖铺贴微缝调平工艺，包括有以下步骤：S1、先铺贴第一块瓷砖，沿着相邻的第一块瓷砖旁边垂直插上PVC卡片；S2、插上PVC卡片后，铺贴第二块瓷砖，所述第二块瓷砖与第一块瓷砖相邻；S3、人工拍打瓷砖表面进行初步调整平整度；S4、使用调平器对瓷砖表面进行二次调整压平；S5、使用瓷片盖设相邻瓷砖缝隙两边进行平整度固定，且所述瓷片正面两侧涂抹有胶水；S6、待瓷片固定胶水风干后，用木锤从瓷砖侧面敲开小瓷片后清洗胶水，即可进行填缝工序，本发明可有效的达到适用于缝隙较小的瓷砖铺贴，提高调平功效率以及便于拆卸等作用。
Novel ceramic tile paving micro-crack leveling process
The invention discloses a novel ceramic tile paving and pasting micro-crack leveling process which comprises the following steps: S1, paving and pasting a first ceramic tile, and vertically inserting a PVC card along the adjacent side of the first ceramic tile; s2, after the PVC card is inserted, a second ceramic tile is laid, and the second ceramic tile is adjacent to the first ceramic tile; s3, the surfaces of the ceramic tiles are manually flapped to preliminarily adjust the flatness; s4, the leveler is used for conducting secondary adjustment and flattening on the surface of the ceramic tile; s5, covering two sides of a gap between the adjacent ceramic tiles with ceramic chips for flatness fixation, and smearing glue on two sides of the front surfaces of the ceramic chips; and S6, after the tile fixing glue is air-dried, the small tiles are knocked open from the side faces of the tiles through a wood hammer, then the glue is cleaned, and then the joint filling procedure can be carried out. The effects of being suitable for laying of the tiles with small joints, improving the leveling efficiency, facilitating disassembly and the like can be effectively achieved.
本发明公开了一种新型瓷砖铺贴微缝调平工艺，包括有以下步骤：S1、先铺贴第一块瓷砖，沿着相邻的第一块瓷砖旁边垂直插上PVC卡片；S2、插上PVC卡片后，铺贴第二块瓷砖，所述第二块瓷砖与第一块瓷砖相邻；S3、人工拍打瓷砖表面进行初步调整平整度；S4、使用调平器对瓷砖表面进行二次调整压平；S5、使用瓷片盖设相邻瓷砖缝隙两边进行平整度固定，且所述瓷片正面两侧涂抹有胶水；S6、待瓷片固定胶水风干后，用木锤从瓷砖侧面敲开小瓷片后清洗胶水，即可进行填缝工序，本发明可有效的达到适用于缝隙较小的瓷砖铺贴，提高调平功效率以及便于拆卸等作用。
Novel ceramic tile paving micro-crack leveling process
一种新型瓷砖铺贴微缝调平工艺
YAO SHUIPING (author)
2022-06-10
Patent
Electronic Resource
Chinese
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
Novel sound insulation leveling large plate ceramic tile glue paving method
| European Patent Office | 2022
Ceramic tile paving machine and ceramic tile paving method
| European Patent Office | 2023
Ceramic tile paving method and automatic ceramic tile paving control system
| European Patent Office | 2021