A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING INSULATING CIRCUIT BOARD
When a plurality of laminated bodies made of different materials and including metal plates are bonded in a pressurized and heated state, a first pressing member on which a first metal foil/carbon sheet or a ceramic sheet/graphite sheet is laminated in this order is disposed such that the first metal foil is in contact with the surface of a first metal plate of the laminated body. The first metal foil is formed of a material that does not react with the first plate member at the contact surface of the first metal foil when heated, the product of the Young's modulus (GPa) and the thickness (mm) of the first metal foil is 0.6-100, the laminate can be uniformly pressurized to produce a good joined body, and adhesion of foreign matter to the surface of the laminate can be suppressed.
在将包括金属板的多个不同材料的层叠体在加压及加热状态下进行接合时，将依次层叠有第一金属箔/碳片或陶瓷片/石墨片的第一按压部件，以第一金属箔与所述层叠体的第一金属板的表面接触的方式配置，第一金属箔由加热时在第一金属箔的接触面不与第一板部件反应的材料形成，第一金属箔的杨氏模量(GPa)与厚度(mm)的乘积为0.6以上且100以下，能够对层叠体进行均匀地加压而制造良好的接合体，能够抑制在层叠体的表面附着异物。
METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING INSULATING CIRCUIT BOARD
When a plurality of laminated bodies made of different materials and including metal plates are bonded in a pressurized and heated state, a first pressing member on which a first metal foil/carbon sheet or a ceramic sheet/graphite sheet is laminated in this order is disposed such that the first metal foil is in contact with the surface of a first metal plate of the laminated body. The first metal foil is formed of a material that does not react with the first plate member at the contact surface of the first metal foil when heated, the product of the Young's modulus (GPa) and the thickness (mm) of the first metal foil is 0.6-100, the laminate can be uniformly pressurized to produce a good joined body, and adhesion of foreign matter to the surface of the laminate can be suppressed.
在将包括金属板的多个不同材料的层叠体在加压及加热状态下进行接合时，将依次层叠有第一金属箔/碳片或陶瓷片/石墨片的第一按压部件，以第一金属箔与所述层叠体的第一金属板的表面接触的方式配置，第一金属箔由加热时在第一金属箔的接触面不与第一板部件反应的材料形成，第一金属箔的杨氏模量(GPa)与厚度(mm)的乘积为0.6以上且100以下，能够对层叠体进行均匀地加压而制造良好的接合体，能够抑制在层叠体的表面附着异物。
METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING INSULATING CIRCUIT BOARD
接合体的制造方法及绝缘电路基板的制造方法
YUMOTO RYOHEI (author) / KITAHARA TAKESHI (author)
2022-09-30
Patent
Electronic Resource
Chinese
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