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Method for connecting silicon nitride ceramic composite structure by using glass solder
The invention discloses a method for connecting a silicon nitride ceramic composite structure by using glass solder, and relates to a method for connecting silicon nitride ceramic. The technical problems that an existing silicon nitride ceramic composite connection structure is not resistant to high temperature and poor in performance are solved. The high-temperature glass solder connection technology is adopted, connection of the porous silicon nitride ceramic and the compact silicon nitride ceramic composite structure is achieved for the first time, a connector has the advantages of being high in strength and resistant to high temperature, and the problem that the silicon nitride ceramic composite structure is not resistant to high temperature is solved; the prepared welding flux has excellent devitrification performance and high crystallization rate, so that a high-melting-point ceramic phase structure is formed by bonding chromatography, the high-temperature resistance of a connector is improved, and a silicon nitride ceramic composite structure after welding can be used for a long time at the temperature of 850 DEG C and used for a short time at the temperature of 1000 DEG C; the glass solder disclosed by the invention is devitrified after being subjected to welding heat cycle to form a glass-ceramic structure, which is a key technology for ensuring that a welding seam can resist high temperature.
一种用玻璃焊料连接氮化硅陶瓷复合结构的方法，涉及一种连接氮化硅陶瓷的方法。本发明是要解决现有的氮化硅陶瓷复合连接结构不抗高温、性能差的技术问题。本发明采用高温玻璃焊料连接技术，首次实现了多孔氮化硅陶瓷与致密氮化硅陶瓷复合结构的连接，接头具有高强度、耐高温的特点和优势，解决了氮化硅陶瓷复合结构不耐高温的问题；本发明制备的焊料具有优异的析晶性，高结晶率使得连接层析出高熔点陶瓷相结构，提高了接头耐高温性能，焊接完成后的氮化硅陶瓷复合结构能在850℃条件下长时间使用，在1000℃短时使用；本发明的玻璃焊料在经过焊接热循环后发生析晶，形成了玻璃‑陶瓷结构，是保证焊缝能够耐高温的关键技术。
Method for connecting silicon nitride ceramic composite structure by using glass solder
The invention discloses a method for connecting a silicon nitride ceramic composite structure by using glass solder, and relates to a method for connecting silicon nitride ceramic. The technical problems that an existing silicon nitride ceramic composite connection structure is not resistant to high temperature and poor in performance are solved. The high-temperature glass solder connection technology is adopted, connection of the porous silicon nitride ceramic and the compact silicon nitride ceramic composite structure is achieved for the first time, a connector has the advantages of being high in strength and resistant to high temperature, and the problem that the silicon nitride ceramic composite structure is not resistant to high temperature is solved; the prepared welding flux has excellent devitrification performance and high crystallization rate, so that a high-melting-point ceramic phase structure is formed by bonding chromatography, the high-temperature resistance of a connector is improved, and a silicon nitride ceramic composite structure after welding can be used for a long time at the temperature of 850 DEG C and used for a short time at the temperature of 1000 DEG C; the glass solder disclosed by the invention is devitrified after being subjected to welding heat cycle to form a glass-ceramic structure, which is a key technology for ensuring that a welding seam can resist high temperature.
一种用玻璃焊料连接氮化硅陶瓷复合结构的方法，涉及一种连接氮化硅陶瓷的方法。本发明是要解决现有的氮化硅陶瓷复合连接结构不抗高温、性能差的技术问题。本发明采用高温玻璃焊料连接技术，首次实现了多孔氮化硅陶瓷与致密氮化硅陶瓷复合结构的连接，接头具有高强度、耐高温的特点和优势，解决了氮化硅陶瓷复合结构不耐高温的问题；本发明制备的焊料具有优异的析晶性，高结晶率使得连接层析出高熔点陶瓷相结构，提高了接头耐高温性能，焊接完成后的氮化硅陶瓷复合结构能在850℃条件下长时间使用，在1000℃短时使用；本发明的玻璃焊料在经过焊接热循环后发生析晶，形成了玻璃‑陶瓷结构，是保证焊缝能够耐高温的关键技术。
Method for connecting silicon nitride ceramic composite structure by using glass solder
一种用玻璃焊料连接氮化硅陶瓷复合结构的方法
SUN LIANGBO (author) / ZHANG JIE (author) / LIU CHUNFENG (author) / SHAN TIPENG (author) / WANG SHUOHAO (author)
2022-11-11
Patent
Electronic Resource
Chinese
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