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A platform for research: civil engineering, architecture and urbanism
Radiating fin
The present invention is a heat dissipation sheet obtained by molding a thermally conductive resin composition obtained by mixing an inorganic filler component and a resin component, the inorganic filler component comprising a first inorganic filler and a second inorganic filler, and the resin component comprising a second inorganic filler and a third inorganic filler. The particle size distribution of the inorganic filler component has a first maximum point (M1) attributable to the first inorganic filler and a second maximum point (M2) attributable to the second inorganic filler, the particle size of the first maximum point (M1) being 15 [mu] m or more, and the particle size of the second maximum point (M2) being two thirds or less of the particle size of the first maximum point (M1). The cumulant of the frequency between the peak start point PS and the peak end point PE in the peak having the first maximum point M1 is 50% or more, the surface roughness is 1.5-3.0 [mu] m, and the thickness is 0.2 mm or less. According to the present invention, it is possible to provide a thin heat sink having excellent thermal conductivity.
本发明为散热片，其是将导热性树脂组合物成型而成的散热片，其中，所述导热性树脂组合物是将无机填料成分和树脂成分配混而成的，无机填料成分包含第1无机填料和第2无机填料，无机填料成分的粒度分布具有归因于第1无机填料的第1极大点M1以及归因于第2无机填料的第2极大点M2，第1极大点M1的粒径为15μm以上，第2极大点M2的粒径为第1极大点M1的粒径的三分之二以下，具有第1极大点M1的峰中的峰起点PS至峰终点PE之间的频率的累积量为50％以上，表面粗糙度为1.5～3.0μm，厚度为0.2mm以下。根据本发明，能够提供具有优异的导热性的薄的散热片。
Radiating fin
The present invention is a heat dissipation sheet obtained by molding a thermally conductive resin composition obtained by mixing an inorganic filler component and a resin component, the inorganic filler component comprising a first inorganic filler and a second inorganic filler, and the resin component comprising a second inorganic filler and a third inorganic filler. The particle size distribution of the inorganic filler component has a first maximum point (M1) attributable to the first inorganic filler and a second maximum point (M2) attributable to the second inorganic filler, the particle size of the first maximum point (M1) being 15 [mu] m or more, and the particle size of the second maximum point (M2) being two thirds or less of the particle size of the first maximum point (M1). The cumulant of the frequency between the peak start point PS and the peak end point PE in the peak having the first maximum point M1 is 50% or more, the surface roughness is 1.5-3.0 [mu] m, and the thickness is 0.2 mm or less. According to the present invention, it is possible to provide a thin heat sink having excellent thermal conductivity.
本发明为散热片，其是将导热性树脂组合物成型而成的散热片，其中，所述导热性树脂组合物是将无机填料成分和树脂成分配混而成的，无机填料成分包含第1无机填料和第2无机填料，无机填料成分的粒度分布具有归因于第1无机填料的第1极大点M1以及归因于第2无机填料的第2极大点M2，第1极大点M1的粒径为15μm以上，第2极大点M2的粒径为第1极大点M1的粒径的三分之二以下，具有第1极大点M1的峰中的峰起点PS至峰终点PE之间的频率的累积量为50％以上，表面粗糙度为1.5～3.0μm，厚度为0.2mm以下。根据本发明，能够提供具有优异的导热性的薄的散热片。
Radiating fin
散热片
WADA KOSUKE (author) / FUJI KIYOTAKA (author) / TANIGUCHI YOSHITAKA (author)
2023-02-03
Patent
Electronic Resource
Chinese