A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
The invention discloses a building engineering building floor comprehensive assembly system which comprises a building floor layer, a plurality of supporting pieces distributed in a matrix mode are arranged on the building floor layer, floor tiles are installed at the tops of the supporting pieces, and an installation space is formed in the bottoms of the floor tiles; the supporting pieces comprise the supporting piece A and the supporting piece B. The supporting piece A and the supporting piece B each comprise a bottom support and an upper support which are connected in a sliding mode, and the bottom supports and the upper supports are filled with filler. A locking screw is arranged on the side part of a bottom support of the supporting piece A, and the locking screw locks the overall height of the supporting piece A; and a pipeline is arranged in the mounting space at the bottom of the floor tile. Efficient leveling of the floor tiles and efficient laying and mounting of the water and electricity heating pipelines are achieved, and follow-up rebuilding, maintenance and transformation of the floor tiles and the water and electricity heating pipelines are facilitated; the system belongs to an assembly type dry construction system, energy conservation and emission reduction are facilitated, the construction speed is high, and construction is not affected by environment temperature; the floor load can be reduced, the floor clear height is increased, and the sound insulation effect is improved.
本发明公开了一种建筑工程楼地面综合装配系统，包括楼地面层，楼地面层上设有多个呈矩阵式分布的支撑件，支撑件顶部安装有地面砖，地面砖底部设有安装空间；支撑件包括支撑件A和支撑件B，支撑件A和支撑件B均包括滑动连接的底部支座和上部支座，底部支座和上部支座内装有填充物；支撑件A的底部支座侧部设有锁紧螺钉，锁紧螺钉将支撑件A整体高度锁定；地面砖底部的安装空间内布设有管线。本发明实现对地面砖的高效调平、对水电暖管线的高效铺设安装，方便地面砖及水电暖管线后续的翻修、维护及改造；属于装配式干法施工体系，利于节能减排，施工速度快，且施工不受环境温度影响；可以减轻楼面荷载，增大楼层净高，提高隔音效果。
The invention discloses a building engineering building floor comprehensive assembly system which comprises a building floor layer, a plurality of supporting pieces distributed in a matrix mode are arranged on the building floor layer, floor tiles are installed at the tops of the supporting pieces, and an installation space is formed in the bottoms of the floor tiles; the supporting pieces comprise the supporting piece A and the supporting piece B. The supporting piece A and the supporting piece B each comprise a bottom support and an upper support which are connected in a sliding mode, and the bottom supports and the upper supports are filled with filler. A locking screw is arranged on the side part of a bottom support of the supporting piece A, and the locking screw locks the overall height of the supporting piece A; and a pipeline is arranged in the mounting space at the bottom of the floor tile. Efficient leveling of the floor tiles and efficient laying and mounting of the water and electricity heating pipelines are achieved, and follow-up rebuilding, maintenance and transformation of the floor tiles and the water and electricity heating pipelines are facilitated; the system belongs to an assembly type dry construction system, energy conservation and emission reduction are facilitated, the construction speed is high, and construction is not affected by environment temperature; the floor load can be reduced, the floor clear height is increased, and the sound insulation effect is improved.
本发明公开了一种建筑工程楼地面综合装配系统，包括楼地面层，楼地面层上设有多个呈矩阵式分布的支撑件，支撑件顶部安装有地面砖，地面砖底部设有安装空间；支撑件包括支撑件A和支撑件B，支撑件A和支撑件B均包括滑动连接的底部支座和上部支座，底部支座和上部支座内装有填充物；支撑件A的底部支座侧部设有锁紧螺钉，锁紧螺钉将支撑件A整体高度锁定；地面砖底部的安装空间内布设有管线。本发明实现对地面砖的高效调平、对水电暖管线的高效铺设安装，方便地面砖及水电暖管线后续的翻修、维护及改造；属于装配式干法施工体系，利于节能减排，施工速度快，且施工不受环境温度影响；可以减轻楼面荷载，增大楼层净高，提高隔音效果。
Building engineering building ground comprehensive assembly system
建筑工程楼地面综合装配系统
LI BIN (author)
2023-03-31
Patent
Electronic Resource
Chinese
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden
Building engineering building ground comprehensive assembly system and construction method
| European Patent Office | 2024