Inorganic board manufacturing method and inorganic board: Fid-Bau Portal

Inorganic board manufacturing method and inorganic board

IKEDA SATOSHI / YOSHIDA KAZUHISA / MOROHOSHI YUTO

In order to provide an inorganic board suitable for achieving high water resistance and a method for manufacturing the inorganic board, the manufacturing method of the present invention includes first to sixth steps. In the first step, a first layer (L1) is formed by stacking a raw material on a receiving plate (B1). In the second step, one end portion (first portion (Ma)) and the other end portion (second portion (Mb)) in the first direction (D1) of the raw material slab (M) including the first layer (L1) are pressed and compressed toward the receiving plate (B1). In the third step, a second layer (L2) is formed on the first layer (L1) by deposition of the raw material. In the fourth step, the exposed surface of the second layer (L2) is planarized. In a fifth step, the raw material slab (M) is cured while being pressed between the receiving plate (B1) and the pressing plate (B2), and a hardened plate (M ') is formed from the raw material slab (M). In a sixth step, the first portion (Ma) is processed to form a first back-side joining portion (P1), and the second portion (Mb) is processed to form a first front-side joining portion (P2). This inorganic plate (X1) is provided with a high-density first back-side joining section (P1) and a high-density first front-side joining section (P2).

为了提供适于实现高耐水性的无机质板及其制造方法，本发明的制造方法包括第一～第六工序。在第一工序中，通过原料向承接板(B1)上的堆积而形成第一层(L1)。在第二工序中，将包括第一层(L1)的原料板坯(M)的第一方向(D1)上的一方端部(第一部分(Ma))和另一方端部(第二部分(Mb))朝向承接板(B1)按压而压缩。在第三工序中，通过原料的堆积而在第一层(L1)上形成第二层(L2)。在第四工序中，使第二层(L2)的露出面平坦化。在第五工序中，将原料板坯(M)在承接板(B1)与压板(B2)之间压紧的状态下进行养护，由原料板坯(M)形成硬化板(M’)。在第六工序中，对第一部分(Ma)进行加工而形成第一背侧接合部(P1)，并且对第二部分(Mb)进行加工而形成第一表侧接合部(P2)。本发明的无机质板(X1)具备高密度的第一背侧接合部(P1)和第一表侧接合部(P2)。

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