A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Epoxy adhesive, preparation method and UHPC-SMA bridge deck pavement method
The invention relates to an epoxy adhesive, a preparation method and a UHPC-SMA bridge deck pavement method. The epoxy adhesive comprises a component A and a component B in a mass ratio of 1: (0.8-1.0), wherein the component A is prepared from the following components in parts by mass: 80 to 100 parts of bisphenol A type epoxy resin, 10 to 20 parts of bisphenol F type epoxy resin, 5 to 15 parts of reactive diluent, 5 to 15 parts of toughening agent and 1 to 3 parts of silane coupling agent; the component B comprises the following components in parts by mass: 50-70 parts of a normal-temperature curing agent, 20-30 parts of a high-temperature curing agent, 0-10 parts of a curing accelerator and 1-3 parts of an anti-settling agent. The epoxy adhesive has the advantages of being good in mechanical property and high in bonding capacity, and the colloid curing process and performance development are matched with the construction process.
本申请涉及一种环氧胶黏剂、制备方法及UHPC‑SMA桥面铺装方法，其包括质量比为1：0.8～1.0的A组份和B组份；其中，按照质量份数计，所述A组分包括：双酚A型环氧树脂80～100份，双酚F型环氧树脂10～20份，活性稀释剂5～15份，增韧剂5～15份，硅烷偶联剂1～3份；按照质量份数计，所述B组分包括：常温固化剂50～70份，高温固化剂20～30份，固化促进剂0～10份，防沉剂1～3份。该环氧胶黏剂具备力学性能好、粘结能力强的优点，胶体固化进程和性能发展与施工过程相匹配。
Epoxy adhesive, preparation method and UHPC-SMA bridge deck pavement method
The invention relates to an epoxy adhesive, a preparation method and a UHPC-SMA bridge deck pavement method. The epoxy adhesive comprises a component A and a component B in a mass ratio of 1: (0.8-1.0), wherein the component A is prepared from the following components in parts by mass: 80 to 100 parts of bisphenol A type epoxy resin, 10 to 20 parts of bisphenol F type epoxy resin, 5 to 15 parts of reactive diluent, 5 to 15 parts of toughening agent and 1 to 3 parts of silane coupling agent; the component B comprises the following components in parts by mass: 50-70 parts of a normal-temperature curing agent, 20-30 parts of a high-temperature curing agent, 0-10 parts of a curing accelerator and 1-3 parts of an anti-settling agent. The epoxy adhesive has the advantages of being good in mechanical property and high in bonding capacity, and the colloid curing process and performance development are matched with the construction process.
本申请涉及一种环氧胶黏剂、制备方法及UHPC‑SMA桥面铺装方法，其包括质量比为1：0.8～1.0的A组份和B组份；其中，按照质量份数计，所述A组分包括：双酚A型环氧树脂80～100份，双酚F型环氧树脂10～20份，活性稀释剂5～15份，增韧剂5～15份，硅烷偶联剂1～3份；按照质量份数计，所述B组分包括：常温固化剂50～70份，高温固化剂20～30份，固化促进剂0～10份，防沉剂1～3份。该环氧胶黏剂具备力学性能好、粘结能力强的优点，胶体固化进程和性能发展与施工过程相匹配。
Epoxy adhesive, preparation method and UHPC-SMA bridge deck pavement method
环氧胶黏剂、制备方法及UHPC-SMA桥面铺装方法
LI TIAN (author) / ZHANG HUABING (author) / CHEN LUYI (author) / CAI YU (author) / WU XIANZHI (author) / LI XIN (author) / HUANG YOUQIANG (author) / WEI PENGLIANG (author) / ZHENG LI (author)
2023-08-29
Patent
Electronic Resource
Chinese
IPC:
C09J
ADHESIVES
,
Klebstoffe
/
C08G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
,
Makromolekulare Verbindungen, anders erhalten als durch Reaktionen, an denen nur ungesättigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind
/
E01D
BRIDGES
,
Brücken
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