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Porous lead-free piezoelectric ceramic element, air coupling porous lead-free ultrasonic transducer and preparation method of air coupling porous lead-free ultrasonic transducer
The invention discloses a porous lead-free piezoelectric ceramic element, an air coupling porous lead-free ultrasonic transducer and a preparation method of the air coupling porous lead-free ultrasonic transducer, and belongs to the technical field of ultrasonic transducers. Pores are uniformly distributed in the element, the porosity is 55%-75%, and the pore structure is Gyandroid; the preparation method comprises the following step: carrying out photocuring 3D printing on the lead-free ceramic powder to obtain the porous piezoelectric ceramic element. The invention discloses an air coupling porous lead-free ultrasonic transducer. The air coupling porous lead-free ultrasonic transducer comprises a porous piezoelectric ceramic element. According to the porous lead-free piezoelectric ceramic element provided by the invention, through the design of pores, the acoustic impedance is reduced to 5.95 MRayl, and the acoustic impedance with air is favorably realized. According to the air coupling porous lead-free ultrasonic transducer provided by the invention, the detection sensitivity reaches-27dB or below.
本发明公开了多孔无铅压电陶瓷元件、空气耦合多孔无铅超声换能器及其制备方法,属于超声换能器技术领域。所述元件中孔隙均匀分布,孔隙率为55%‑75%,孔结构为Gyroid;其制备方法包括:无铅陶瓷粉经光固化3D打印成多孔压电陶瓷元件。本发明公开的空气耦合多孔无铅超声换能器包含多孔压电陶瓷元件。本发明提供的多孔无铅压电陶瓷元件,通过孔隙的设计,使得声阻抗降低到5.95MRayl,利于与空气实现声阻抗。本发明提供的空气耦合多孔无铅超声换能器,检测灵敏度达到‑27dB以下。
Porous lead-free piezoelectric ceramic element, air coupling porous lead-free ultrasonic transducer and preparation method of air coupling porous lead-free ultrasonic transducer
The invention discloses a porous lead-free piezoelectric ceramic element, an air coupling porous lead-free ultrasonic transducer and a preparation method of the air coupling porous lead-free ultrasonic transducer, and belongs to the technical field of ultrasonic transducers. Pores are uniformly distributed in the element, the porosity is 55%-75%, and the pore structure is Gyandroid; the preparation method comprises the following step: carrying out photocuring 3D printing on the lead-free ceramic powder to obtain the porous piezoelectric ceramic element. The invention discloses an air coupling porous lead-free ultrasonic transducer. The air coupling porous lead-free ultrasonic transducer comprises a porous piezoelectric ceramic element. According to the porous lead-free piezoelectric ceramic element provided by the invention, through the design of pores, the acoustic impedance is reduced to 5.95 MRayl, and the acoustic impedance with air is favorably realized. According to the air coupling porous lead-free ultrasonic transducer provided by the invention, the detection sensitivity reaches-27dB or below.
本发明公开了多孔无铅压电陶瓷元件、空气耦合多孔无铅超声换能器及其制备方法,属于超声换能器技术领域。所述元件中孔隙均匀分布,孔隙率为55%‑75%,孔结构为Gyroid;其制备方法包括:无铅陶瓷粉经光固化3D打印成多孔压电陶瓷元件。本发明公开的空气耦合多孔无铅超声换能器包含多孔压电陶瓷元件。本发明提供的多孔无铅压电陶瓷元件,通过孔隙的设计,使得声阻抗降低到5.95MRayl,利于与空气实现声阻抗。本发明提供的空气耦合多孔无铅超声换能器,检测灵敏度达到‑27dB以下。
Porous lead-free piezoelectric ceramic element, air coupling porous lead-free ultrasonic transducer and preparation method of air coupling porous lead-free ultrasonic transducer
多孔无铅压电陶瓷元件、空气耦合多孔无铅超声换能器及其制备方法
ZHANG HAIBO (author) / ZHOU XINYI (author) / GAO HUAYUN (author) / TAN HUA (author) / MA WEIGANG (author) / LIU KAI (author) / XIAO JIANZHONG (author) / GUO XIN (author)
2023-09-29
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
/
B06B
GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
,
Erzeugen oder Übertragen mechanischer Schwingungen allgemein
/
B33Y
ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
,
Additive (generative) Fertigung, d. h. die Herstellung von dreidimensionalen [3D] Bauteilen durch additive Abscheidung, additive Agglomeration oder additive Schichtung, z. B. durch 3D- Drucken, Stereolithografie oder selektives Lasersintern
European Patent Office | 2021
|European Patent Office | 2018
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