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Low-temperature connection method for aluminum oxide ceramic and 1060 pure aluminum
The invention provides a low-temperature connection method of aluminum oxide ceramic and 1060 pure aluminum, which comprises the following steps: preparing bismuthate glass powder from Bi2O3, B2O3, ZnO, MgO and TiO2 as raw materials, forming a to-be-welded connecting piece from the aluminum oxide ceramic and the 1060 pure aluminum by using glass soldering paste prepared from the bismuthate glass powder and an organic carrier as brazing filler metal, and performing brazing treatment at the temperature of 420-500 DEG C to obtain the low-temperature connection of the aluminum oxide ceramic and the 1060 pure aluminum. The low-temperature reliable connection of the aluminum oxide ceramic and 1060 pure aluminum is realized; compared with the prior art, the bismuthate glass powder has lower glass-transition temperature, glass softening temperature and thermal expansion coefficient, the welding temperature of the bismuthate glass powder and pure aluminum is reduced, low-temperature connection of aluminum oxide ceramic and 1060 pure aluminum is realized, the thermal expansion coefficient of the bismuthate glass powder is closer to that of the aluminum oxide ceramic, the residual stress of a welding seam is reduced, and the welding quality is improved. The strength of the joint is improved; the method is simple in process, low in cost, small in deformation and environmentally friendly, and belongs to the technical field of dissimilar material welding.
本发明提供了一种氧化铝陶瓷与1060纯铝的低温连接方法，以Bi2O3、B2O3、ZnO、MgO和TiO2为原料制成铋酸盐玻璃粉，再以铋酸盐玻璃粉与有机载体制成的玻璃焊膏为钎料，将氧化铝陶瓷与1060纯铝形成待焊连接件，在420～500℃的温度下钎焊处理，实现氧化铝陶瓷与1060纯铝的低温可靠连接；与现有技术相比，本发明的铋酸盐玻璃粉具有较低的玻璃化转变温度、玻璃软化温度和热膨胀系数，降低了其与纯铝的焊接温度，实现了氧化铝陶瓷与1060纯铝的低温连接，同时其热膨胀系数与氧化铝陶瓷更为接近，降低了焊缝的残余应力，提高了接头的强度；本发明工艺简单、成本低、变形小、绿色环保，属于异种材料焊接技术领域。
Low-temperature connection method for aluminum oxide ceramic and 1060 pure aluminum
The invention provides a low-temperature connection method of aluminum oxide ceramic and 1060 pure aluminum, which comprises the following steps: preparing bismuthate glass powder from Bi2O3, B2O3, ZnO, MgO and TiO2 as raw materials, forming a to-be-welded connecting piece from the aluminum oxide ceramic and the 1060 pure aluminum by using glass soldering paste prepared from the bismuthate glass powder and an organic carrier as brazing filler metal, and performing brazing treatment at the temperature of 420-500 DEG C to obtain the low-temperature connection of the aluminum oxide ceramic and the 1060 pure aluminum. The low-temperature reliable connection of the aluminum oxide ceramic and 1060 pure aluminum is realized; compared with the prior art, the bismuthate glass powder has lower glass-transition temperature, glass softening temperature and thermal expansion coefficient, the welding temperature of the bismuthate glass powder and pure aluminum is reduced, low-temperature connection of aluminum oxide ceramic and 1060 pure aluminum is realized, the thermal expansion coefficient of the bismuthate glass powder is closer to that of the aluminum oxide ceramic, the residual stress of a welding seam is reduced, and the welding quality is improved. The strength of the joint is improved; the method is simple in process, low in cost, small in deformation and environmentally friendly, and belongs to the technical field of dissimilar material welding.
本发明提供了一种氧化铝陶瓷与1060纯铝的低温连接方法，以Bi2O3、B2O3、ZnO、MgO和TiO2为原料制成铋酸盐玻璃粉，再以铋酸盐玻璃粉与有机载体制成的玻璃焊膏为钎料，将氧化铝陶瓷与1060纯铝形成待焊连接件，在420～500℃的温度下钎焊处理，实现氧化铝陶瓷与1060纯铝的低温可靠连接；与现有技术相比，本发明的铋酸盐玻璃粉具有较低的玻璃化转变温度、玻璃软化温度和热膨胀系数，降低了其与纯铝的焊接温度，实现了氧化铝陶瓷与1060纯铝的低温连接，同时其热膨胀系数与氧化铝陶瓷更为接近，降低了焊缝的残余应力，提高了接头的强度；本发明工艺简单、成本低、变形小、绿色环保，属于异种材料焊接技术领域。
Low-temperature connection method for aluminum oxide ceramic and 1060 pure aluminum
一种氧化铝陶瓷与1060纯铝的低温连接方法
FU WEI (author) / XUE YIDI (author) / SONG XIAOGUO (author) / LONG WEIMIN (author) / YU SHUHAO (author) / HU SHENGPENG (author) / BIAN HONG (author)
2023-10-03
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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