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The invention provides a high-density block Cu2SnSe3 thermoelectric material and a low-temperature sintering preparation method thereof, and the method comprises the steps: S1, carrying out the mixing and grinding of Cu powder, Sn powder and Se powder according to the stoichiometric ratio of Cu2SnSe3, and obtaining mixed powder; then adding a solvent accounting for 0.5-5% of the mass of the mixed powder, and uniformly mixing to obtain a prefabricated material; and S2, placing the prefabricated material in a high-pressure mold, and carrying out high-pressure and low-temperature sintering at 150-220 DEG C to obtain the high-density block Cu2SnSe3 thermoelectric material, wherein the boiling point of the solvent is lower than the high-pressure low-temperature sintering temperature. A small amount of volatile solvent is mixed into the raw material powder to wrap the raw material particles, so that the solvent is volatilized to leave a reaction system to form capillary action force in the high-pressure and low-temperature sintering process, the particles are combined more tightly, and the compactness, strength and thermoelectric performance of the thermoelectric material are improved.
本发明提供了一种高致密块体Cu2SnSe3热电材料及其低温烧结制备方法，该方法包括：S1.将Cu粉、Sn粉和Se粉按照Cu2SnSe3化学计量比混合研磨，得到混合粉体；然后加入所述混合粉体质量0.5％‑5％的溶剂，混合均匀，得到预制物料；S2.将所述预制物料置于高压模具中，在150‑220℃下进行高压低温烧结，即得到高致密块体Cu2SnSe3热电材料；其中，所述溶剂的沸点低于高压低温烧结的温度。本发明通过在原料粉体中混入少量挥发性溶剂，包裹原料颗粒，使得在高压低温烧结过程中，溶剂挥发离开反应体系形成毛细管作用力，从而使颗粒间结合更紧密，进而提高热电材料的致密性和强度以及热电性能。
The invention provides a high-density block Cu2SnSe3 thermoelectric material and a low-temperature sintering preparation method thereof, and the method comprises the steps: S1, carrying out the mixing and grinding of Cu powder, Sn powder and Se powder according to the stoichiometric ratio of Cu2SnSe3, and obtaining mixed powder; then adding a solvent accounting for 0.5-5% of the mass of the mixed powder, and uniformly mixing to obtain a prefabricated material; and S2, placing the prefabricated material in a high-pressure mold, and carrying out high-pressure and low-temperature sintering at 150-220 DEG C to obtain the high-density block Cu2SnSe3 thermoelectric material, wherein the boiling point of the solvent is lower than the high-pressure low-temperature sintering temperature. A small amount of volatile solvent is mixed into the raw material powder to wrap the raw material particles, so that the solvent is volatilized to leave a reaction system to form capillary action force in the high-pressure and low-temperature sintering process, the particles are combined more tightly, and the compactness, strength and thermoelectric performance of the thermoelectric material are improved.
本发明提供了一种高致密块体Cu2SnSe3热电材料及其低温烧结制备方法，该方法包括：S1.将Cu粉、Sn粉和Se粉按照Cu2SnSe3化学计量比混合研磨，得到混合粉体；然后加入所述混合粉体质量0.5％‑5％的溶剂，混合均匀，得到预制物料；S2.将所述预制物料置于高压模具中，在150‑220℃下进行高压低温烧结，即得到高致密块体Cu2SnSe3热电材料；其中，所述溶剂的沸点低于高压低温烧结的温度。本发明通过在原料粉体中混入少量挥发性溶剂，包裹原料颗粒，使得在高压低温烧结过程中，溶剂挥发离开反应体系形成毛细管作用力，从而使颗粒间结合更紧密，进而提高热电材料的致密性和强度以及热电性能。
High-density block Cu2SnSe3 thermoelectric material and low-temperature sintering preparation method thereof
高致密块体Cu2SnSe3热电材料及其低温烧结制备方法
CHENG XIN (author)
2023-10-24
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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