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Microstructure control of electrically conductive materials by surface coating of powder
An example deposition method may include introducing hydrogen into a processing chamber, a powder disposed within a processing region of the processing chamber. The method may include triggering a first plasma in the processing region, the first plasma including an energetic hydrogen species. The method may include exposing the powder to an energetic hydrogen species in the treatment region. The method may include chemically reducing the powder by reaction of the powder with the energetic hydrogen species. The method may include removing a process effluent including unreacted hydrogen from the treatment region. The method may also include forming a material layer on the particles of the powder within the processing region.
示例沉积方法可包括将氢引入到处理腔室中，粉末设置在处理腔室的处理区域内。方法可包括在处理区域中触发第一等离子体，第一等离子体包括高能氢物种。方法可包括将粉末暴露于处理区域中的高能氢物种。方法可包括通过粉末与高能氢物种的反应来化学地还原粉末。方法可包括从处理区域去除包括未反应氢的工艺流出物。方法还可包括在处理区域内的粉末的颗粒上形成材料层。
Microstructure control of electrically conductive materials by surface coating of powder
An example deposition method may include introducing hydrogen into a processing chamber, a powder disposed within a processing region of the processing chamber. The method may include triggering a first plasma in the processing region, the first plasma including an energetic hydrogen species. The method may include exposing the powder to an energetic hydrogen species in the treatment region. The method may include chemically reducing the powder by reaction of the powder with the energetic hydrogen species. The method may include removing a process effluent including unreacted hydrogen from the treatment region. The method may also include forming a material layer on the particles of the powder within the processing region.
示例沉积方法可包括将氢引入到处理腔室中，粉末设置在处理腔室的处理区域内。方法可包括在处理区域中触发第一等离子体，第一等离子体包括高能氢物种。方法可包括将粉末暴露于处理区域中的高能氢物种。方法可包括通过粉末与高能氢物种的反应来化学地还原粉末。方法可包括从处理区域去除包括未反应氢的工艺流出物。方法还可包括在处理区域内的粉末的颗粒上形成材料层。
Microstructure control of electrically conductive materials by surface coating of powder
通过粉末的表面涂覆来进行的导电材料的微结构控制
SCHURR MARC (author) / REIMER PETER (author) / GAO HONG P (author) / DESHPANDE CHANDRA V (author)
2023-11-17
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME