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Ceramic powder modification method, ceramic slurry and application
The invention belongs to the technical field of photocuring printing, and particularly relates to a ceramic powder modification method, ceramic slurry and application. The ceramic powder is subjected to surface functional modification, the refractive index of the powder is improved, the curing depth of the slurry is further improved, and when the ceramic chopper green body is formed through photocuring-assisted direct writing printing, curing of the wall thickness of the ceramic chopper green body can be met. The ceramic slurry prepared from the functional modified ceramic powder can reduce the surface roughness of the ceramic chopper, so that the surface roughness Ra of the extruded and formed ceramic chopper is reduced to 0.15 [mu] m or below (the fluctuation range of the surface of a ceramic blank prepared by using photocuring 3D printing at present is about 5 [mu] m), and the surface of the ceramic blank is uniform and flat; the problem that the surface precision of the ceramic chopper formed through direct writing is difficult to improve is solved, so that contamination of a welding nozzle surface caused by the fact that the surface roughness value of the ceramic chopper is too large is avoided, the service life of the chopper is prolonged, and abrasion of a metal welding wire is reduced.
本发明属于光固化打印技术领域，具体涉及一种陶瓷粉体改性方法、陶瓷浆料及应用。本发明通过对陶瓷粉体进行表面功能化修饰，改善粉体折射率，进一步提高了浆料的固化深度，在光固化辅助直写打印成型陶瓷劈刀坯体时，可以满足陶瓷劈刀坯体壁厚的固化。使用功能性修饰的陶瓷粉体制备的陶瓷浆料能够降低陶瓷劈刀表面粗糙度，使挤出成形的陶瓷劈刀表面粗糙度Ra降低至0.15μm以下(目前使用光固化3D打印制备陶瓷坯体表面的波动范围约为5μm)，实现了陶瓷坯体表面均匀平整，解决了直写成形的陶瓷劈刀表面精度难以提高的问题，从而避免陶瓷劈刀的表面粗糙度值过大而导致焊嘴面沾污，延长了劈刀的使用寿命，以及减少金属焊线磨损。
Ceramic powder modification method, ceramic slurry and application
The invention belongs to the technical field of photocuring printing, and particularly relates to a ceramic powder modification method, ceramic slurry and application. The ceramic powder is subjected to surface functional modification, the refractive index of the powder is improved, the curing depth of the slurry is further improved, and when the ceramic chopper green body is formed through photocuring-assisted direct writing printing, curing of the wall thickness of the ceramic chopper green body can be met. The ceramic slurry prepared from the functional modified ceramic powder can reduce the surface roughness of the ceramic chopper, so that the surface roughness Ra of the extruded and formed ceramic chopper is reduced to 0.15 [mu] m or below (the fluctuation range of the surface of a ceramic blank prepared by using photocuring 3D printing at present is about 5 [mu] m), and the surface of the ceramic blank is uniform and flat; the problem that the surface precision of the ceramic chopper formed through direct writing is difficult to improve is solved, so that contamination of a welding nozzle surface caused by the fact that the surface roughness value of the ceramic chopper is too large is avoided, the service life of the chopper is prolonged, and abrasion of a metal welding wire is reduced.
本发明属于光固化打印技术领域，具体涉及一种陶瓷粉体改性方法、陶瓷浆料及应用。本发明通过对陶瓷粉体进行表面功能化修饰，改善粉体折射率，进一步提高了浆料的固化深度，在光固化辅助直写打印成型陶瓷劈刀坯体时，可以满足陶瓷劈刀坯体壁厚的固化。使用功能性修饰的陶瓷粉体制备的陶瓷浆料能够降低陶瓷劈刀表面粗糙度，使挤出成形的陶瓷劈刀表面粗糙度Ra降低至0.15μm以下(目前使用光固化3D打印制备陶瓷坯体表面的波动范围约为5μm)，实现了陶瓷坯体表面均匀平整，解决了直写成形的陶瓷劈刀表面精度难以提高的问题，从而避免陶瓷劈刀的表面粗糙度值过大而导致焊嘴面沾污，延长了劈刀的使用寿命，以及减少金属焊线磨损。
Ceramic powder modification method, ceramic slurry and application
一种陶瓷粉体改性方法、陶瓷浆料及应用
YANG ZHIHUA (author) / ZHANG YANZHAO (author) / ZHOU GUOXIANG (author) / HE YUNPENG (author) / YE WENFENG (author) / JIA DECHANG (author) / ZHOU YU (author)
2024-01-26
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
/
B33Y
ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
,
Additive (generative) Fertigung, d. h. die Herstellung von dreidimensionalen [3D] Bauteilen durch additive Abscheidung, additive Agglomeration oder additive Schichtung, z. B. durch 3D- Drucken, Stereolithografie oder selektives Lasersintern
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