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Al2O3-AlN in-situ composite ceramic, method for preparing Al2O3-AlN in-situ composite ceramic through additive manufacturing and application
The invention provides an Al2O3-AlN in-situ composite ceramic, a method for preparing the Al2O3-AlN in-situ composite ceramic through additive manufacturing and application of the Al2O3-AlN in-situ composite ceramic, and the method comprises the following steps: mixing aluminum oxide powder, a stabilizer and a solvent, and carrying out ball milling to obtain a first mixture; heating and stirring the first mixture, mixing the first mixture with a binder, and then performing pressurized stirring to obtain a second mixture; the second mixture is sequentially cooled and crushed, obtained particles are subjected to additive manufacturing, and a formed workpiece is obtained; the formed workpiece is degreased, the obtained degreased workpiece is sintered under the condition of containing a nitrogen element, and the Al2O3-AlN in-situ composite ceramic is obtained. According to the invention, the advantages of low cost of Al2O3 ceramic and high thermal conductivity of AlN ceramic are combined, the advantage of integrated construction of a complex structure through additive manufacturing is utilized, the cost is low, the operation is simple, the improvement of the surface heat dissipation capability of the chip packaging substrate is facilitated, and the problem of failure caused by different thermal expansion coefficients of the ceramic surface and the chip is solved.
本发明提供一种Al2O3‑AlN原位复合陶瓷及增材制造制备其的方法和应用，所述方法包括：混合氧化铝粉末、稳定剂和溶剂，球磨，得到第一混合物；所述第一混合物经加热搅拌，并混入粘结剂后再经加压搅拌，得到第二混合物；所述第二混合物依次经冷却和破碎，得到的颗粒料经增材制造，得到成型工件；所述成型工件经脱脂，得到的脱脂后工件在含氮元素的条件下进行烧结处理，得到Al2O3‑AlN原位复合陶瓷。本发明结合了Al2O3陶瓷的低成本和AlN陶瓷的高热导率优点，利用增材制造一体化构筑复杂结构的优势，成本低操作简单，有利于芯片封装基板的表面散热能力的提升，且解决了陶瓷表面与芯片热膨胀系数不一引起的失效问题的优点。
Al2O3-AlN in-situ composite ceramic, method for preparing Al2O3-AlN in-situ composite ceramic through additive manufacturing and application
The invention provides an Al2O3-AlN in-situ composite ceramic, a method for preparing the Al2O3-AlN in-situ composite ceramic through additive manufacturing and application of the Al2O3-AlN in-situ composite ceramic, and the method comprises the following steps: mixing aluminum oxide powder, a stabilizer and a solvent, and carrying out ball milling to obtain a first mixture; heating and stirring the first mixture, mixing the first mixture with a binder, and then performing pressurized stirring to obtain a second mixture; the second mixture is sequentially cooled and crushed, obtained particles are subjected to additive manufacturing, and a formed workpiece is obtained; the formed workpiece is degreased, the obtained degreased workpiece is sintered under the condition of containing a nitrogen element, and the Al2O3-AlN in-situ composite ceramic is obtained. According to the invention, the advantages of low cost of Al2O3 ceramic and high thermal conductivity of AlN ceramic are combined, the advantage of integrated construction of a complex structure through additive manufacturing is utilized, the cost is low, the operation is simple, the improvement of the surface heat dissipation capability of the chip packaging substrate is facilitated, and the problem of failure caused by different thermal expansion coefficients of the ceramic surface and the chip is solved.
本发明提供一种Al2O3‑AlN原位复合陶瓷及增材制造制备其的方法和应用，所述方法包括：混合氧化铝粉末、稳定剂和溶剂，球磨，得到第一混合物；所述第一混合物经加热搅拌，并混入粘结剂后再经加压搅拌，得到第二混合物；所述第二混合物依次经冷却和破碎，得到的颗粒料经增材制造，得到成型工件；所述成型工件经脱脂，得到的脱脂后工件在含氮元素的条件下进行烧结处理，得到Al2O3‑AlN原位复合陶瓷。本发明结合了Al2O3陶瓷的低成本和AlN陶瓷的高热导率优点，利用增材制造一体化构筑复杂结构的优势，成本低操作简单，有利于芯片封装基板的表面散热能力的提升，且解决了陶瓷表面与芯片热膨胀系数不一引起的失效问题的优点。
Al2O3-AlN in-situ composite ceramic, method for preparing Al2O3-AlN in-situ composite ceramic through additive manufacturing and application
一种Al2O3-AlN原位复合陶瓷及增材制造制备其的方法和应用
ZHAO GUORUI (author) / CHEN XIUJUAN (author) / WANG ENGE (author)
2024-02-09
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
/
B33Y
ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
,
Additive (generative) Fertigung, d. h. die Herstellung von dreidimensionalen [3D] Bauteilen durch additive Abscheidung, additive Agglomeration oder additive Schichtung, z. B. durch 3D- Drucken, Stereolithografie oder selektives Lasersintern
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