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A platform for research: civil engineering, architecture and urbanism
Novel floor heating paving method and floor heating structure
The invention provides a novel floor heating paving method and a floor heating structure, the novel floor heating paving method comprises a floor heating module assembled on the ground, a pressure bearing plate paved on the top surface of the floor heating module and a flexible plate paved on the top surface of the pressure bearing plate, the floor heating module comprises a plate body and keels arranged on the opposite sides of the plate body, the top surface of the plate body is provided with a pipe groove, and the flexible plate is arranged in the pipe groove. According to the floor heating structure, the floor heating module, the bearing plate and the flexible plate form the floor heating structure, the floor heating module is composed of the plate body and the keels on the two sides, the pipe groove where the floor heating pipe is laid is formed in the top face of the plate body, the floor heating pipe is arranged in the pipe groove, gridding cloth is laid on the top face of the flexible plate, and the self-adhesive layer is laid on the bottom face of the flexible plate and used for being bonded with the bearing plate. Gridding cloth and a self-adhesive layer are laid on the top face and the bottom face of the flexible plate respectively. According to the floor heating structure, the using amount of mortar in the ceramic tile laying process can be reduced, thin pasting of ceramic tiles is achieved, the heating effect of floor heating is guaranteed, the floor height is reduced, the floor mass is reduced, the environment-friendly requirement is met, and resources are saved.
本发明提供一种新型地暖铺装方法及地暖结构，包括拼装在地面上的地暖模块、铺设在地暖模块顶面的承压板和铺设在承压板顶面的柔性板，其中，地暖模块包括板体以及设置在板体对立侧的龙骨，板体的顶面设置有管槽，管槽内设置有地暖管，柔性板的顶面铺设有网格布，柔性板的底面铺设有自粘层，用于与承压板粘接，本发明通过地暖模块、承压板和柔性板形成地暖结构，并且地暖模块通过板体以及两侧的龙骨组成，板体的顶面设置铺设地暖管的管槽，柔性板顶面和底面分别铺设网格布和自粘层，本发明的地暖结构可以减少瓷砖铺设过程中的灰浆使用量，实现瓷砖薄贴，保证地暖的采暖效果，并减少楼层高度，减轻楼层质量，满足环保要求，节约资源。
Novel floor heating paving method and floor heating structure
The invention provides a novel floor heating paving method and a floor heating structure, the novel floor heating paving method comprises a floor heating module assembled on the ground, a pressure bearing plate paved on the top surface of the floor heating module and a flexible plate paved on the top surface of the pressure bearing plate, the floor heating module comprises a plate body and keels arranged on the opposite sides of the plate body, the top surface of the plate body is provided with a pipe groove, and the flexible plate is arranged in the pipe groove. According to the floor heating structure, the floor heating module, the bearing plate and the flexible plate form the floor heating structure, the floor heating module is composed of the plate body and the keels on the two sides, the pipe groove where the floor heating pipe is laid is formed in the top face of the plate body, the floor heating pipe is arranged in the pipe groove, gridding cloth is laid on the top face of the flexible plate, and the self-adhesive layer is laid on the bottom face of the flexible plate and used for being bonded with the bearing plate. Gridding cloth and a self-adhesive layer are laid on the top face and the bottom face of the flexible plate respectively. According to the floor heating structure, the using amount of mortar in the ceramic tile laying process can be reduced, thin pasting of ceramic tiles is achieved, the heating effect of floor heating is guaranteed, the floor height is reduced, the floor mass is reduced, the environment-friendly requirement is met, and resources are saved.
本发明提供一种新型地暖铺装方法及地暖结构，包括拼装在地面上的地暖模块、铺设在地暖模块顶面的承压板和铺设在承压板顶面的柔性板，其中，地暖模块包括板体以及设置在板体对立侧的龙骨，板体的顶面设置有管槽，管槽内设置有地暖管，柔性板的顶面铺设有网格布，柔性板的底面铺设有自粘层，用于与承压板粘接，本发明通过地暖模块、承压板和柔性板形成地暖结构，并且地暖模块通过板体以及两侧的龙骨组成，板体的顶面设置铺设地暖管的管槽，柔性板顶面和底面分别铺设网格布和自粘层，本发明的地暖结构可以减少瓷砖铺设过程中的灰浆使用量，实现瓷砖薄贴，保证地暖的采暖效果，并减少楼层高度，减轻楼层质量，满足环保要求，节约资源。
Novel floor heating paving method and floor heating structure
一种新型地暖铺装方法及地暖结构
LIU JIANGHONG (author) / JIN MENG (author) / LI RENBANG (author)
2024-02-23
Patent
Electronic Resource
Chinese
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