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Preparation method of ultrathin Lu3-xAl5O12: Cex3 + laser ceramic wafer
The invention belongs to the technical field of luminescent materials, and relates to a preparation method of an ultrathin Lu3-xAl5O12: Cex3 + laser ceramic chip, which comprises the following steps: (1) uniformly mixing raw materials, carrying out cold isostatic pressing treatment and molding, and carrying out pressurized calcination treatment; (2) annealing treatment; (3) cutting and thinning treatment; (4) the thickness is reduced, and a Lu3-xAl5O12: Cex3 + ceramic sheet is obtained; and (5) double-sided finish polishing treatment. The ultrathin Lu3-xAl5O12: Cex3 + laser ceramic chip prepared by the invention has stable physical and chemical properties, has the advantages of thin thickness, good light transmission, high luminous intensity, strong temperature resistance, fast heat dissipation, high optical density and the like, and has better competitive advantages in the fields of high power and laser illumination; and the preparation method is simple, easy to operate, low in cost, free of pollution and easy for industrial production.
本发明属于发光材料技术领域，涉及一种超薄Lu3‑xAl5O12:Cex3+激光陶瓷片的制备方法，包括如下步骤：(1)原料均匀混合，冷等静压处理成型，加压煅烧处理；(2)退火处理；(3)切割、减薄处理；(4)厚度减薄得Lu3‑xAl5O12:Cex3+陶瓷薄片；(5)双面精抛光处理。本发明制备的超薄Lu3‑xAl5O12:Cex3+激光陶瓷片物理化学性能稳定，具有厚度薄、透光性好、发光强度高、耐温性强、散热快和光密度高等优点，在大功率和激光照明领域具有更好的竞争优势；且制备方法简单，容易操作，低成本，无污染、易于工业化生产。
Preparation method of ultrathin Lu3-xAl5O12: Cex3 + laser ceramic wafer
The invention belongs to the technical field of luminescent materials, and relates to a preparation method of an ultrathin Lu3-xAl5O12: Cex3 + laser ceramic chip, which comprises the following steps: (1) uniformly mixing raw materials, carrying out cold isostatic pressing treatment and molding, and carrying out pressurized calcination treatment; (2) annealing treatment; (3) cutting and thinning treatment; (4) the thickness is reduced, and a Lu3-xAl5O12: Cex3 + ceramic sheet is obtained; and (5) double-sided finish polishing treatment. The ultrathin Lu3-xAl5O12: Cex3 + laser ceramic chip prepared by the invention has stable physical and chemical properties, has the advantages of thin thickness, good light transmission, high luminous intensity, strong temperature resistance, fast heat dissipation, high optical density and the like, and has better competitive advantages in the fields of high power and laser illumination; and the preparation method is simple, easy to operate, low in cost, free of pollution and easy for industrial production.
本发明属于发光材料技术领域，涉及一种超薄Lu3‑xAl5O12:Cex3+激光陶瓷片的制备方法，包括如下步骤：(1)原料均匀混合，冷等静压处理成型，加压煅烧处理；(2)退火处理；(3)切割、减薄处理；(4)厚度减薄得Lu3‑xAl5O12:Cex3+陶瓷薄片；(5)双面精抛光处理。本发明制备的超薄Lu3‑xAl5O12:Cex3+激光陶瓷片物理化学性能稳定，具有厚度薄、透光性好、发光强度高、耐温性强、散热快和光密度高等优点，在大功率和激光照明领域具有更好的竞争优势；且制备方法简单，容易操作，低成本，无污染、易于工业化生产。
Preparation method of ultrathin Lu3-xAl5O12: Cex3 + laser ceramic wafer
一种超薄Lu3-xAl5O12:Cex3+激光陶瓷片的制备方法
LIU TIANYONG (author) / DENG HUA (author) / BI YANGANG (author) / LIU TIEGANG (author) / ZENG QINGYUN (author) / YU XIANGYUN (author) / LI TING (author) / WANG SHANSHAN (author)
2024-03-19
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
/
B24B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
,
Maschinen, Einrichtungen oder Verfahren zum Schleifen oder Polieren
/
B28B
Formgeben von Ton oder anderen keramischen Stoffzusammensetzungen, Schlacke oder von Mischungen, die zementartiges Material enthalten, z.B. Putzmörtel
,
SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
/
B28D
Bearbeiten von Stein oder steinähnlichen Werkstoffen
,
WORKING STONE OR STONE-LIKE MATERIALS
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