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Preparation method and application of high-power device packaging material
The invention relates to the technical field of semiconductor packaging, in particular to a preparation method and application of a high-power device packaging material, which optimizes the field intensity and voltage endurance capability and improves the heat dissipation capability by utilizing the packaging material with paramagnetic materials (ferroferric oxide, cobalt powder and nickel powder). Meanwhile, the conductive layer (conductive graphite paper) is arranged to absorb electromagnetic waves, so that the stray inductance of the device is reduced, and the reliability of the device is improved. Besides, before the encapsulation material is encapsulated, the ceramic layer is plated by magnetic sputtering, so that the orderliness of lattice arrangement is improved, the resistivity of the power device during working is improved, and the voltage resistance and reliability of the device are further improved.
本发明涉及半导体封装技术领域，具体为一种高功率器件封装材料制备方法及应用，通过利用具有顺磁材料(四氧化三铁、钴粉、镍粉)的封装材料，优化场强和耐压能力、提高散热能力。同时设置导电层(导电石墨纸)吸收电磁波，降低了器件的杂散电感、提高了器件的可靠性。此外，在灌封封装材料前，进行磁溅射镀上一成陶瓷层，提升了晶格排列的有序性，提高功率器件工作时的电阻率，进一步提高了器件的耐压性和可靠性。
Preparation method and application of high-power device packaging material
The invention relates to the technical field of semiconductor packaging, in particular to a preparation method and application of a high-power device packaging material, which optimizes the field intensity and voltage endurance capability and improves the heat dissipation capability by utilizing the packaging material with paramagnetic materials (ferroferric oxide, cobalt powder and nickel powder). Meanwhile, the conductive layer (conductive graphite paper) is arranged to absorb electromagnetic waves, so that the stray inductance of the device is reduced, and the reliability of the device is improved. Besides, before the encapsulation material is encapsulated, the ceramic layer is plated by magnetic sputtering, so that the orderliness of lattice arrangement is improved, the resistivity of the power device during working is improved, and the voltage resistance and reliability of the device are further improved.
本发明涉及半导体封装技术领域，具体为一种高功率器件封装材料制备方法及应用，通过利用具有顺磁材料(四氧化三铁、钴粉、镍粉)的封装材料，优化场强和耐压能力、提高散热能力。同时设置导电层(导电石墨纸)吸收电磁波，降低了器件的杂散电感、提高了器件的可靠性。此外，在灌封封装材料前，进行磁溅射镀上一成陶瓷层，提升了晶格排列的有序性，提高功率器件工作时的电阻率，进一步提高了器件的耐压性和可靠性。
Preparation method and application of high-power device packaging material
一种高功率器件封装材料制备方法及应用
DUAN JINCHI (author) / LIAO GUANGCHAO (author)
2024-03-29
Patent
Electronic Resource
Chinese
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