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A platform for research: civil engineering, architecture and urbanism
Flat sealing structure assembly of flat sealing structure ceramic sealing piece and high-precision sealing method of flat sealing structure assembly
The invention relates to the technical field of ceramic packaging bodies, and discloses a high-precision sealing method of a flat-sealing-structure ceramic sealing piece, which comprises the following steps: S1, firstly plating a T < i > film on the upper end surface and the lower end surface of ceramic to realize metallization, and taking a Ti film as a basic film for ceramic metallization; s2, the plated ceramic piece is heated and subjected to heat preservation treatment in a vacuum atmosphere environment, and the binding force of the T < i > film layer and the ceramic is improved; s3, sequentially plating a Cu film and an Ag film on the upper end surface and the lower end surface of the porcelain piece; and S4, after being clamped and fixed by the special flat sealing structure assembly, the coated ceramic and metal piece are heated in a vacuum furnace and subjected to heat preservation for a period of time. The ceramic is plated with the micron-level Cu and Ag metal thin films after being plated with the Ti film to achieve metallization, the micron-level Cu and Ag metal thin films serve as reaction film layers of transition liquid phase diffusion welding, the variable quantity in the height direction before and after assembly sealing is remarkably improved, the high-precision sealing effect is achieved, and the control consistency of the intervals of all electrodes of a ceramic sealing piece of a vacuum electronic device flat sealing structure is improved.
本申请涉及陶瓷封装体技术领域，公开了平封结构瓷封件的高精度封接方法，包括以下方法步骤：S1、在陶瓷上、下端面首先镀覆T i膜实现金属化，其中Ti膜作为陶瓷金属化的基础膜；S2、将镀覆后的瓷件在真空气氛环境下加热保温处理，提升T i膜层与陶瓷结合力；S3、在瓷件的上、下端面先后镀覆Cu膜、Ag膜；S4、覆膜后陶瓷与金属件在专用平封结构组件夹持固定后在真空炉下加热并保温一段时间。通过将陶瓷在镀T i膜实现金属化后镀覆μm级别Cu、Ag金属薄膜，作为过渡液相扩散焊的反应膜层，显著改善了组件封接前后高度方向的变化量，实现了高精度封接效果，提升了真空电子器件平封结构瓷封件各极间距控制一致性。
Flat sealing structure assembly of flat sealing structure ceramic sealing piece and high-precision sealing method of flat sealing structure assembly
The invention relates to the technical field of ceramic packaging bodies, and discloses a high-precision sealing method of a flat-sealing-structure ceramic sealing piece, which comprises the following steps: S1, firstly plating a T < i > film on the upper end surface and the lower end surface of ceramic to realize metallization, and taking a Ti film as a basic film for ceramic metallization; s2, the plated ceramic piece is heated and subjected to heat preservation treatment in a vacuum atmosphere environment, and the binding force of the T < i > film layer and the ceramic is improved; s3, sequentially plating a Cu film and an Ag film on the upper end surface and the lower end surface of the porcelain piece; and S4, after being clamped and fixed by the special flat sealing structure assembly, the coated ceramic and metal piece are heated in a vacuum furnace and subjected to heat preservation for a period of time. The ceramic is plated with the micron-level Cu and Ag metal thin films after being plated with the Ti film to achieve metallization, the micron-level Cu and Ag metal thin films serve as reaction film layers of transition liquid phase diffusion welding, the variable quantity in the height direction before and after assembly sealing is remarkably improved, the high-precision sealing effect is achieved, and the control consistency of the intervals of all electrodes of a ceramic sealing piece of a vacuum electronic device flat sealing structure is improved.
本申请涉及陶瓷封装体技术领域，公开了平封结构瓷封件的高精度封接方法，包括以下方法步骤：S1、在陶瓷上、下端面首先镀覆T i膜实现金属化，其中Ti膜作为陶瓷金属化的基础膜；S2、将镀覆后的瓷件在真空气氛环境下加热保温处理，提升T i膜层与陶瓷结合力；S3、在瓷件的上、下端面先后镀覆Cu膜、Ag膜；S4、覆膜后陶瓷与金属件在专用平封结构组件夹持固定后在真空炉下加热并保温一段时间。通过将陶瓷在镀T i膜实现金属化后镀覆μm级别Cu、Ag金属薄膜，作为过渡液相扩散焊的反应膜层，显著改善了组件封接前后高度方向的变化量，实现了高精度封接效果，提升了真空电子器件平封结构瓷封件各极间距控制一致性。
Flat sealing structure assembly of flat sealing structure ceramic sealing piece and high-precision sealing method of flat sealing structure assembly
平封结构瓷封件的平封结构组件及其高精度封接方法
REN ZHONG (author) / WANG JINGYU (author) / YANG MENGYAO (author) / TANG ZHONGHUA (author) / ZHOU CHAOYANG (author) / LIU YINGBO (author)
2024-04-05
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME