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Surface selective metallization ceramic and preparation method and application thereof
The invention discloses a surface selective metallization ceramic. The surface selective metallization ceramic is prepared by the following steps: (1) covering the surface of a ceramic substrate; (2) pre-treating the uncovered part of the surface of the ceramic base material: removing grease and surface hydroxylation, and forming, densifying and activating a self-assembled monomolecular layer; (3) metalizing the uncovered part of the surface of the ceramic substrate; and (4) removing the 3D printing ink covering layer. The preparation method of the surface selective metallization ceramic is simple and easy to operate, the process is green and environment-friendly, and the cost is low. According to the prepared ceramic surface copper metal layer, the binding force between the copper metal layer and the ceramic base material is excellent, the density of the copper metal layer is good, and the microstructure in the copper metal layer is uniform. The surface selective metallization ceramic and the preparation method thereof provided by the invention can provide reference for a new generation of semiconductor manufacturing technology, and have great significance.
本发明公开一种表面可选择性金属化陶瓷，采用如下步骤制备得到：(1)陶瓷基材表面覆盖；(2)陶瓷基材表面未覆盖部分预处理：除油脂与表面羟基化、自组装单分子层的形成及其致密化、活化；(3)陶瓷基材表面未覆盖部分金属化；(4)去除3D打印油墨覆盖层。本发明表面可选择性金属化陶瓷的制备方法简便易操作，过程绿色环保，成本低廉。本发明制备得到的陶瓷表面铜金属层与陶瓷基材之间的结合力优异，铜金属层致密度良好，且铜金属层中的微观组织结构均一。本发明表面可选择性金属化陶瓷及其制备方法可为新一代半导体制造技术提供参考，具有重大意义。
Surface selective metallization ceramic and preparation method and application thereof
The invention discloses a surface selective metallization ceramic. The surface selective metallization ceramic is prepared by the following steps: (1) covering the surface of a ceramic substrate; (2) pre-treating the uncovered part of the surface of the ceramic base material: removing grease and surface hydroxylation, and forming, densifying and activating a self-assembled monomolecular layer; (3) metalizing the uncovered part of the surface of the ceramic substrate; and (4) removing the 3D printing ink covering layer. The preparation method of the surface selective metallization ceramic is simple and easy to operate, the process is green and environment-friendly, and the cost is low. According to the prepared ceramic surface copper metal layer, the binding force between the copper metal layer and the ceramic base material is excellent, the density of the copper metal layer is good, and the microstructure in the copper metal layer is uniform. The surface selective metallization ceramic and the preparation method thereof provided by the invention can provide reference for a new generation of semiconductor manufacturing technology, and have great significance.
本发明公开一种表面可选择性金属化陶瓷，采用如下步骤制备得到：(1)陶瓷基材表面覆盖；(2)陶瓷基材表面未覆盖部分预处理：除油脂与表面羟基化、自组装单分子层的形成及其致密化、活化；(3)陶瓷基材表面未覆盖部分金属化；(4)去除3D打印油墨覆盖层。本发明表面可选择性金属化陶瓷的制备方法简便易操作，过程绿色环保，成本低廉。本发明制备得到的陶瓷表面铜金属层与陶瓷基材之间的结合力优异，铜金属层致密度良好，且铜金属层中的微观组织结构均一。本发明表面可选择性金属化陶瓷及其制备方法可为新一代半导体制造技术提供参考，具有重大意义。
Surface selective metallization ceramic and preparation method and application thereof
一种表面可选择性金属化陶瓷及其制备方法与应用
JIN BOYIN (author) / YAN CHANGLI (author) / CHEN KANGZHUANG (author) / ZHANG WENBI (author)
2024-04-09
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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