A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
The invention provides a polishing method and a polishing system. The polishing method comprises the following steps: providing a substrate; polishing the surface of the substrate by adopting an ion beam polishing process; and etching and polishing the surface of the substrate by adopting a chemical dry etching process. Compared with the prior art, the polishing method provided by the invention combines an ion beam polishing process and a chemical dry etching process. The method comprises the following steps: firstly, polishing the surface of a substrate by adopting an ion beam polishing process so as to realize atomic-scale polishing of the substrate by utilizing a sputtering effect and a flowing effect caused by an ion beam and improve the flatness of the surface of the substrate; the surface of the substrate is etched and polished by adopting a chemical dry etching process, so that the roughness of the surface of the substrate is improved, the three indexes of flatness, roughness and defect degree are considered, and the polishing effect is effectively improved.
本发明提供一种抛光方法及抛光系统。其中，所述抛光方法包括：提供一衬底；采用离子束抛光工艺抛光所述衬底表面；采用化学干刻工艺刻蚀并抛光所述衬底表面。相较于现有技术，本发明提供的所述抛光方法将离子束抛光工艺和化学干刻工艺相结合。先采用离子束抛光工艺抛光衬底表面，以利用离子束引发的溅射效应和流动效应，实现对所述衬底的原子级抛光，提高所述衬底表面的平坦度；再采用化学干法刻蚀工艺刻蚀并抛光所述衬底的表面，以提高所述衬底表面的粗糙度，从而兼顾了平坦度、粗糙度和缺陷度这三个指标，有效提高抛光效果。
The invention provides a polishing method and a polishing system. The polishing method comprises the following steps: providing a substrate; polishing the surface of the substrate by adopting an ion beam polishing process; and etching and polishing the surface of the substrate by adopting a chemical dry etching process. Compared with the prior art, the polishing method provided by the invention combines an ion beam polishing process and a chemical dry etching process. The method comprises the following steps: firstly, polishing the surface of a substrate by adopting an ion beam polishing process so as to realize atomic-scale polishing of the substrate by utilizing a sputtering effect and a flowing effect caused by an ion beam and improve the flatness of the surface of the substrate; the surface of the substrate is etched and polished by adopting a chemical dry etching process, so that the roughness of the surface of the substrate is improved, the three indexes of flatness, roughness and defect degree are considered, and the polishing effect is effectively improved.
本发明提供一种抛光方法及抛光系统。其中，所述抛光方法包括：提供一衬底；采用离子束抛光工艺抛光所述衬底表面；采用化学干刻工艺刻蚀并抛光所述衬底表面。相较于现有技术，本发明提供的所述抛光方法将离子束抛光工艺和化学干刻工艺相结合。先采用离子束抛光工艺抛光衬底表面，以利用离子束引发的溅射效应和流动效应，实现对所述衬底的原子级抛光，提高所述衬底表面的平坦度；再采用化学干法刻蚀工艺刻蚀并抛光所述衬底的表面，以提高所述衬底表面的粗糙度，从而兼顾了平坦度、粗糙度和缺陷度这三个指标，有效提高抛光效果。
Polishing method and polishing system
抛光方法及抛光系统
LIN YUEMING (author)
2024-04-16
Patent
Electronic Resource
Chinese
IPC:
G03F
Fotomechanische Herstellung strukturierter oder gemusterter Oberflächen, z.B. zum Drucken, zum Herstellen von Halbleiterbauelementen
,
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES
/
C03C
Chemische Zusammensetzungen für Gläser, Glasuren oder Emails
,
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS
/
C04B
Kalk
,
LIME
/
C23F
Nichtmechanisches Entfernen metallischer Stoffe von Oberflächen
,
NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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