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Silver plating structure for ceramic chip and silver plating method for ceramic chip
The invention relates to the technical field of electronic ceramic silver plating, and discloses a ceramic chip silver plating structure and a ceramic chip silver plating method.The ceramic chip is placed in waterproof paper, a center line is arranged at the symmetric center position of the waterproof paper, and the waterproof paper is equally divided into first waterproof paper and second waterproof paper through the center line; the first waterproof paper and the second waterproof paper on the two sides of the center line are respectively provided with a folding line in parallel, the distance between the two folding lines corresponds to the thickness of the ceramic wafer, so that the thickness of the ceramic wafer is effectively controlled in the silver plating process, and the first waterproof paper and the second waterproof paper are respectively provided with hollow holes by taking the center line as a symmetry axis; the ceramic chip is placed on the first waterproof paper and pressed on the hollow hole, and the size of the hollow hole corresponds to the area, needing silver plating, in the ceramic chip, so that the silver plating area of the ceramic chip can be adjusted and controlled conveniently.
本发明涉及电子陶瓷镀银技术领域，公开了一种用于陶瓷片镀银结构及陶瓷片镀银的方法，通过将陶瓷片放置在防水纸中，防水纸在对称中心位置处设置中心线，中心线将防水纸平分为第一防水纸和第二防水纸；并且在中心线的两侧的第一防水纸和第二防水纸分别平行设置折线，两条折线的距离与陶瓷片的厚度对应，使得在镀银过程中有效的对陶瓷片的厚度进行把控，并在第一防水纸和第二防水纸分别以中心线为对称轴设置空心孔；所述陶瓷片放置在第一防水纸上，且压在空心孔上，空心孔的大小与陶瓷片中所需镀银的面积对应，便于对陶瓷片的镀银面积进行调控。
Silver plating structure for ceramic chip and silver plating method for ceramic chip
The invention relates to the technical field of electronic ceramic silver plating, and discloses a ceramic chip silver plating structure and a ceramic chip silver plating method.The ceramic chip is placed in waterproof paper, a center line is arranged at the symmetric center position of the waterproof paper, and the waterproof paper is equally divided into first waterproof paper and second waterproof paper through the center line; the first waterproof paper and the second waterproof paper on the two sides of the center line are respectively provided with a folding line in parallel, the distance between the two folding lines corresponds to the thickness of the ceramic wafer, so that the thickness of the ceramic wafer is effectively controlled in the silver plating process, and the first waterproof paper and the second waterproof paper are respectively provided with hollow holes by taking the center line as a symmetry axis; the ceramic chip is placed on the first waterproof paper and pressed on the hollow hole, and the size of the hollow hole corresponds to the area, needing silver plating, in the ceramic chip, so that the silver plating area of the ceramic chip can be adjusted and controlled conveniently.
本发明涉及电子陶瓷镀银技术领域，公开了一种用于陶瓷片镀银结构及陶瓷片镀银的方法，通过将陶瓷片放置在防水纸中，防水纸在对称中心位置处设置中心线，中心线将防水纸平分为第一防水纸和第二防水纸；并且在中心线的两侧的第一防水纸和第二防水纸分别平行设置折线，两条折线的距离与陶瓷片的厚度对应，使得在镀银过程中有效的对陶瓷片的厚度进行把控，并在第一防水纸和第二防水纸分别以中心线为对称轴设置空心孔；所述陶瓷片放置在第一防水纸上，且压在空心孔上，空心孔的大小与陶瓷片中所需镀银的面积对应，便于对陶瓷片的镀银面积进行调控。
Silver plating structure for ceramic chip and silver plating method for ceramic chip
一种用于陶瓷片镀银结构及陶瓷片镀银的方法
JIN QUAN (author) / BAI XIAOLIANG (author) / FAN ZHIHAI (author) / CAI KE (author) / SONG ENPENG (author) / FANG LIUYA (author) / XU HUI (author)
2024-05-10
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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