A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Ceramic curved surface metal film plating device
The invention discloses a device for plating a metal film on the surface of a ceramic curved surface, and belongs to the field of metal film plating. A ceramic curved surface metal film plating device comprises a plating box, an evaporation plate is fixedly connected to the bottom of an inner cavity of the plating box, a plating plate is rotationally connected to the top of the inner cavity of the plating box, and positioning suction cups are fixedly connected to the two sides of the bottom of the plating plate; according to the invention, the inert gas is filled to push the driving impeller to rotate, so that the gasified upward target material is uniformly contacted with the bottom surface of the substrate, a uniform thin film is formed on the substrate, and the plating effect is improved; and the utilized inert gas flows out upwards from the gas spraying pipe to push the gasified target material to quickly reach the bottom surface of the substrate, so that the plating efficiency is improved, and the high temperature around the evaporation disc is pushed upwards to be in contact with the bottom surface of the substrate, so that the bottom surface of the substrate is preheated, the substrate is better combined with the target material, and the quality of the substrate is improved. Therefore, the plating effect is improved.
本发明公开了一种陶瓷曲面表面金属膜的镀覆装置，属于金属膜镀覆领域。一种陶瓷曲面表面金属膜的镀覆装置，包括镀覆箱，所述镀覆箱内腔底部固定连接有蒸镀盘，所述镀覆箱内腔顶部转动连接有镀覆盘，所述镀覆盘底部两侧均固定连接有定位吸盘；本发明通过充入惰性气体推动驱动叶轮进行转动，使得气化上行的靶材均匀地与基板底面相接触，从而在基板上形成均匀的薄膜，提高了镀覆效果；并且将利用后的惰性气体从喷气管向上流出，推动气化的靶材快速地到达基板底面，提高了镀覆效率，并以此将蒸镀盘周围的高温向上推移，使得高温接触基板底面，从而对基板底面进行预热，使得基板更好地与靶材相结合，以此提高了镀覆的效果。
Ceramic curved surface metal film plating device
The invention discloses a device for plating a metal film on the surface of a ceramic curved surface, and belongs to the field of metal film plating. A ceramic curved surface metal film plating device comprises a plating box, an evaporation plate is fixedly connected to the bottom of an inner cavity of the plating box, a plating plate is rotationally connected to the top of the inner cavity of the plating box, and positioning suction cups are fixedly connected to the two sides of the bottom of the plating plate; according to the invention, the inert gas is filled to push the driving impeller to rotate, so that the gasified upward target material is uniformly contacted with the bottom surface of the substrate, a uniform thin film is formed on the substrate, and the plating effect is improved; and the utilized inert gas flows out upwards from the gas spraying pipe to push the gasified target material to quickly reach the bottom surface of the substrate, so that the plating efficiency is improved, and the high temperature around the evaporation disc is pushed upwards to be in contact with the bottom surface of the substrate, so that the bottom surface of the substrate is preheated, the substrate is better combined with the target material, and the quality of the substrate is improved. Therefore, the plating effect is improved.
本发明公开了一种陶瓷曲面表面金属膜的镀覆装置，属于金属膜镀覆领域。一种陶瓷曲面表面金属膜的镀覆装置，包括镀覆箱，所述镀覆箱内腔底部固定连接有蒸镀盘，所述镀覆箱内腔顶部转动连接有镀覆盘，所述镀覆盘底部两侧均固定连接有定位吸盘；本发明通过充入惰性气体推动驱动叶轮进行转动，使得气化上行的靶材均匀地与基板底面相接触，从而在基板上形成均匀的薄膜，提高了镀覆效果；并且将利用后的惰性气体从喷气管向上流出，推动气化的靶材快速地到达基板底面，提高了镀覆效率，并以此将蒸镀盘周围的高温向上推移，使得高温接触基板底面，从而对基板底面进行预热，使得基板更好地与靶材相结合，以此提高了镀覆的效果。
Ceramic curved surface metal film plating device
一种陶瓷曲面表面金属膜的镀覆装置
2024-06-28
Patent
Electronic Resource
Chinese
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