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Potting material for resistor
The invention discloses a potting material for a resistor, and belongs to the technical field of electronic devices, the potting material for the resistor comprises a potting material dry powder A and a diluent B; the mass ratio of the sealing material dry powder A to the diluent B is 100: (35-45); the mass fraction of the 80-mesh quartz sand in the sealing material dry powder A is 35%-45%, the mass fraction of the 200-mesh quartz sand in the sealing material dry powder A is 25%-30%, and the mass fraction of the 2000-mesh silica powder in the sealing material dry powder A is 30%-35%; and the diluent B is a mixture of an organic silicon resin glue solution and an ethanol solution in a mass ratio of 1: (2-2.2). By adjusting the mesh number and proportion of the sealing material dry powder, ball milling is not needed, and silica powder with good intersolubility with quartz sand is used for replacing 1200-mesh glass fiber powder, so that the mixing and dissolving time can be shortened, and the production efficiency can be improved; the potting material has better stability, moisture resistance and vibration resistance, and pollution to the environment and damage to the health of operators caused by the potting material can be avoided.
本发明公开了一种用于电阻器的灌封料，属于电子器件技术领域，该用于电阻器的灌封料，包括封料干粉A和稀释剂B；封料干粉A和稀释剂B的质量比为100：35‑45；封料干粉A中80目石英砂的质量分数为35％‑45％、200目石英砂的质量分数为25％‑30％和2000目硅微粉的质量分数为30％‑35％；稀释剂B为质量比1：2‑2.2的机硅树脂胶液和乙醇溶液混合。通过调整封料干粉的目数与比例，无须球磨，使用与石英砂有较好互溶性的硅微粉，代替1200目玻纤粉，能够缩短混溶时间，提高生产效率；灌封料具有更好的稳定性和耐潮湿性，抗振动性能更好，而且还能够避免灌封料对环境的污染以及对操作人员健康的损害。
Potting material for resistor
The invention discloses a potting material for a resistor, and belongs to the technical field of electronic devices, the potting material for the resistor comprises a potting material dry powder A and a diluent B; the mass ratio of the sealing material dry powder A to the diluent B is 100: (35-45); the mass fraction of the 80-mesh quartz sand in the sealing material dry powder A is 35%-45%, the mass fraction of the 200-mesh quartz sand in the sealing material dry powder A is 25%-30%, and the mass fraction of the 2000-mesh silica powder in the sealing material dry powder A is 30%-35%; and the diluent B is a mixture of an organic silicon resin glue solution and an ethanol solution in a mass ratio of 1: (2-2.2). By adjusting the mesh number and proportion of the sealing material dry powder, ball milling is not needed, and silica powder with good intersolubility with quartz sand is used for replacing 1200-mesh glass fiber powder, so that the mixing and dissolving time can be shortened, and the production efficiency can be improved; the potting material has better stability, moisture resistance and vibration resistance, and pollution to the environment and damage to the health of operators caused by the potting material can be avoided.
本发明公开了一种用于电阻器的灌封料，属于电子器件技术领域，该用于电阻器的灌封料，包括封料干粉A和稀释剂B；封料干粉A和稀释剂B的质量比为100：35‑45；封料干粉A中80目石英砂的质量分数为35％‑45％、200目石英砂的质量分数为25％‑30％和2000目硅微粉的质量分数为30％‑35％；稀释剂B为质量比1：2‑2.2的机硅树脂胶液和乙醇溶液混合。通过调整封料干粉的目数与比例，无须球磨，使用与石英砂有较好互溶性的硅微粉，代替1200目玻纤粉，能够缩短混溶时间，提高生产效率；灌封料具有更好的稳定性和耐潮湿性，抗振动性能更好，而且还能够避免灌封料对环境的污染以及对操作人员健康的损害。
Potting material for resistor
一种用于电阻器的灌封料
XU LIYUAN (author) / ZHANG CHUANJIE (author) / WANG CAIJUAN (author) / MI CHAO (author) / LI GUOLIANG (author) / ZHENG LIANG (author)
2024-09-10
Patent
Electronic Resource
Chinese
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