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A platform for research: civil engineering, architecture and urbanism
Method for producing hydrophobic silica molded bodies
The invention relates to a method for producing hydrophobic silica molded bodies, wherein i) a mixture comprising hydrophilic silicic acid is added to a hydrophobic device at a maximum temperature of 55 DEG C, and ii) the mixture obtained in step i) is compacted after a storage time of at most 30 days to form a molded body, iii) during steps ii and iii and until the molded body is used, the temperature being at most 55 DEG C.
本发明涉及用于生产疏水二氧化硅模制体的方法，其中i）在55°C的最高温度下将包含亲水硅酸的混合物添加到疏水装置中，并且ii）在最多30天的存储时间之后压实步骤i）中得到的混合物以形成模制体，iii）在步骤ii和iii期间以及直到使用模制体，温度最高是55°C。
Method for producing hydrophobic silica molded bodies
The invention relates to a method for producing hydrophobic silica molded bodies, wherein i) a mixture comprising hydrophilic silicic acid is added to a hydrophobic device at a maximum temperature of 55 DEG C, and ii) the mixture obtained in step i) is compacted after a storage time of at most 30 days to form a molded body, iii) during steps ii and iii and until the molded body is used, the temperature being at most 55 DEG C.
本发明涉及用于生产疏水二氧化硅模制体的方法，其中i）在55°C的最高温度下将包含亲水硅酸的混合物添加到疏水装置中，并且ii）在最多30天的存储时间之后压实步骤i）中得到的混合物以形成模制体，iii）在步骤ii和iii期间以及直到使用模制体，温度最高是55°C。
Method for producing hydrophobic silica molded bodies
用于生产疏水二氧化硅模制体的方法
HINDELANG KONRAD (author) / WEIDNER RICHARD (author) / JANTKE DOMINIK (author)
2024-09-24
Patent
Electronic Resource
Chinese
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