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Pit digging mechanism, pit digging equipment and pit digging method for floor support plate
The invention provides a pit digging mechanism, pit digging equipment and a pit digging method for a floor support plate. The pit digging mechanism comprises one or more pit digging assemblies. The pit digging assembly comprises a first pit digging disc and a second pit digging disc; the floor support plate comprises a bending line; the first pit digging disc and the second pit digging disc correspond to the inner side and the outer side of the bending line respectively, the first pit digging disc comprises a plurality of pit digging columns which are arranged at intervals in the circumferential direction, the second pit digging disc comprises a plurality of pit digging recesses which are arranged at intervals in the circumferential direction, and when the bending line passes through the passing space in the feeding direction, the first pit digging column and the second pit digging recess are separated from each other. The first pit digging disc and the second pit digging disc rotate oppositely, and the multiple pit digging columns and the multiple pit digging recesses are sequentially and correspondingly embedded so that multiple pits can be stretched out of the bending lines between the multiple pit digging columns and the multiple pit digging recesses. By applying the technical scheme, the pit digging mechanism, the pit digging equipment and the pit digging method of the floor support plate can be provided, and an accurate pit structure can be formed at the bending line of the floor support plate.
本发明提供了一种楼承板的打坑机构、打坑设备和打坑方法,所述打坑机构包括一个或多个打坑组件;所述打坑组件包括第一打坑盘和第二打坑盘;所述楼承板包括弯折线处;所述第一打坑盘和第二打坑盘分别对应所述弯折线处的内外两侧,所述第一打坑盘包括沿着周向间隔布置的多个打坑柱,所述第二打坑盘包括沿着周向间隔布置的多个打坑凹进,所述弯折线处沿着一进给方向通过所述通过空间时,所述第一打坑盘和第二打坑盘相向转动,所述多个打坑柱和多个打坑凹进依次对应嵌合以将位于所述多个打坑柱和多个打坑凹进之间所述弯折线处拉伸出多个凹坑。应用本技术方案可提供楼承板的打坑机构、打坑设备和打坑方法,能够的楼承板的弯折线处打出精确的凹坑结构。
Pit digging mechanism, pit digging equipment and pit digging method for floor support plate
The invention provides a pit digging mechanism, pit digging equipment and a pit digging method for a floor support plate. The pit digging mechanism comprises one or more pit digging assemblies. The pit digging assembly comprises a first pit digging disc and a second pit digging disc; the floor support plate comprises a bending line; the first pit digging disc and the second pit digging disc correspond to the inner side and the outer side of the bending line respectively, the first pit digging disc comprises a plurality of pit digging columns which are arranged at intervals in the circumferential direction, the second pit digging disc comprises a plurality of pit digging recesses which are arranged at intervals in the circumferential direction, and when the bending line passes through the passing space in the feeding direction, the first pit digging column and the second pit digging recess are separated from each other. The first pit digging disc and the second pit digging disc rotate oppositely, and the multiple pit digging columns and the multiple pit digging recesses are sequentially and correspondingly embedded so that multiple pits can be stretched out of the bending lines between the multiple pit digging columns and the multiple pit digging recesses. By applying the technical scheme, the pit digging mechanism, the pit digging equipment and the pit digging method of the floor support plate can be provided, and an accurate pit structure can be formed at the bending line of the floor support plate.
本发明提供了一种楼承板的打坑机构、打坑设备和打坑方法,所述打坑机构包括一个或多个打坑组件;所述打坑组件包括第一打坑盘和第二打坑盘;所述楼承板包括弯折线处;所述第一打坑盘和第二打坑盘分别对应所述弯折线处的内外两侧,所述第一打坑盘包括沿着周向间隔布置的多个打坑柱,所述第二打坑盘包括沿着周向间隔布置的多个打坑凹进,所述弯折线处沿着一进给方向通过所述通过空间时,所述第一打坑盘和第二打坑盘相向转动,所述多个打坑柱和多个打坑凹进依次对应嵌合以将位于所述多个打坑柱和多个打坑凹进之间所述弯折线处拉伸出多个凹坑。应用本技术方案可提供楼承板的打坑机构、打坑设备和打坑方法,能够的楼承板的弯折线处打出精确的凹坑结构。
Pit digging mechanism, pit digging equipment and pit digging method for floor support plate
一种楼承板的打坑机构、打坑设备和打坑方法
YANG QINCHENG (author) / YAN YONGPING (author) / LI BIN (author) / LIN HUALU (author) / CHEN WENBIN (author)
2025-01-07
Patent
Electronic Resource
Chinese
European Patent Office | 2023
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