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SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE
A power module substrate (10) includes an insulating substrate (11), and a circuit layer (12) that is formed on one surface of the insulating substrate (11). The circuit layer (12) is formed by bonding a first copper plate (22) onto one surface of the insulating substrate (11). Prior to bonding, the first copper plate (22) has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities.
SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE
A power module substrate (10) includes an insulating substrate (11), and a circuit layer (12) that is formed on one surface of the insulating substrate (11). The circuit layer (12) is formed by bonding a first copper plate (22) onto one surface of the insulating substrate (11). Prior to bonding, the first copper plate (22) has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities.
SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE
SUBSTRAT FÜR LEISTUNGSMODUL, SUBSTRAT FÜR LEISTUNGSMODUL MIT KÜHLKÖRPER, LEISTUNGSMODUL, UND VERFAHREN ZUR HERSTELLUNG EINES SUBSTRATS FÜR EIN LEISTUNGSMODUL
SUBSTRAT POUR MODULE DE PUISSANCE, SUBSTRAT POUR MODULE DE PUISSANCE À PUIT THERMIQUE, MODULE DE PUISSANCE ET PROCÉDÉ DE FABRICATION DE SUBSTRAT POUR MODULE DE PUISSANCE
KUROMITSU YOSHIROU (author) / NAGATOMO YOSHIYUKI (author) / TERASAKI NOBUYUKI (author) / SAKAMOTO TOSHIO (author) / MAKI KAZUNARI (author) / MORI HIROYUKI (author) / ARAI ISAO (author)
2018-05-02
Patent
Electronic Resource
English
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