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Porous material and honeycomb structure
There is disclosed a porous material which has an improved thermal shock resistance. The porous material contains aggregates and a composite binder. The composite binder includes glass as a binder and mullite particles as reinforcing particles, and the mullite particles are dispersed in the glass. The aggregates are connected to each other by the composite binder in a state where pores are formed in the porous material. Preferably, a lower limit of a percentage of a content of the composite binder to a total mass of the aggregates and composite binder is 12 mass%, and an upper limit of the percentage of the content of the composite binder to the total mass of the aggregates and composite binder is 50 mass%. Preferably, the glass contains MgO, Al 2 O 3 and SiO 2 and further contains at least one selected from a group consisting of Na 2 O K 2 O and CaO.
Porous material and honeycomb structure
There is disclosed a porous material which has an improved thermal shock resistance. The porous material contains aggregates and a composite binder. The composite binder includes glass as a binder and mullite particles as reinforcing particles, and the mullite particles are dispersed in the glass. The aggregates are connected to each other by the composite binder in a state where pores are formed in the porous material. Preferably, a lower limit of a percentage of a content of the composite binder to a total mass of the aggregates and composite binder is 12 mass%, and an upper limit of the percentage of the content of the composite binder to the total mass of the aggregates and composite binder is 50 mass%. Preferably, the glass contains MgO, Al 2 O 3 and SiO 2 and further contains at least one selected from a group consisting of Na 2 O K 2 O and CaO.
Porous material and honeycomb structure
Poröses Material und Wabenstruktur
Matériau poreux et structure en nid d'abeilles
IZUMI YUNIE (author) / KOBAYASHI YOSHIMASA (author)
2019-06-12
Patent
Electronic Resource
English
IPC:
C04B
Kalk
,
LIME
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