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BONDED BODY, INSULATED CIRCUIT BOARD WITH HEAT SINK, AND HEAT SINK
An aluminum alloy member (31) is made of an aluminum alloy having a Mg concentration set in a range of 0.4 mass% or more and 7.0 mass% or less and a Si concentration set to less than 1 mass%, the aluminum alloy member (31) and a copper member (13B) are bonded to each other through solid-phase diffusion, and a compound layer (40) made up of a first intermetallic compound layer (41) that is disposed on the aluminum alloy member (31) side and made of a θ phase of an intermetallic compound of Cu and Al, a second intermetallic compound layer (42) that is disposed on the copper member (13B) side and made of a γ2 phase of an intermetallic compound of Cu and Al, and a Cu-Al-Mg layer (43) provided between the first intermetallic compound layer (41) and the second intermetallic compound layer (42) is provided in a bonding interface between the aluminum alloy member (31) and the copper member (13B).
BONDED BODY, INSULATED CIRCUIT BOARD WITH HEAT SINK, AND HEAT SINK
An aluminum alloy member (31) is made of an aluminum alloy having a Mg concentration set in a range of 0.4 mass% or more and 7.0 mass% or less and a Si concentration set to less than 1 mass%, the aluminum alloy member (31) and a copper member (13B) are bonded to each other through solid-phase diffusion, and a compound layer (40) made up of a first intermetallic compound layer (41) that is disposed on the aluminum alloy member (31) side and made of a θ phase of an intermetallic compound of Cu and Al, a second intermetallic compound layer (42) that is disposed on the copper member (13B) side and made of a γ2 phase of an intermetallic compound of Cu and Al, and a Cu-Al-Mg layer (43) provided between the first intermetallic compound layer (41) and the second intermetallic compound layer (42) is provided in a bonding interface between the aluminum alloy member (31) and the copper member (13B).
BONDED BODY, INSULATED CIRCUIT BOARD WITH HEAT SINK, AND HEAT SINK
VERBUNDENER KÖRPER, ISOLIERTE PLATINE MIT KÜHLKÖRPER UND KÜHLKÖRPER
CORPS LIÉ, CARTE DE CIRCUIT ISOLÉE AVEC DISSIPATEUR THERMIQUE, ET DISSIPATEUR THERMIQUE
TERASAKI NOBUYUKI (author)
2023-12-27
Patent
Electronic Resource
English
PROCESS FOR MANUFACTURING INSULATED HEAT SINK, AND INSULATED HEAT SINK
| European Patent Office | 2023
METHOD FOR PRODUCING INSULATED CIRCUIT BOARD WITH HEAT SINK
| European Patent Office | 2023