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HINGE ASSEMBLY FOR A FOLDABLE ELECTRONIC DEVICE
A hinge assembly (1) comprising a first row (2) of hinge plates (3a), a second row (4) of hinge plates (3b) being offset in relation to the first row (2) of hinge plates (3a) such that a hinge plate (3b) of the second row (4) partially overlaps a hinge plate (3a) of the first row (2), and a support rod (5a, 5b). Each support rod (5a, 5b) passes through a hinge plate (3a, 3b) of one row and borders a neighboring hinge plate (3b, 3a) of another row, so that the neighboring hinge plate (3b, 3a) can fold around the support rod (5a, 5b). The hinge assembly (1) has as small outer dimensions as possible, while still providing a range of movement which allows a wide range of movement as well as provides support for any component extending across the hinge assembly (1).
HINGE ASSEMBLY FOR A FOLDABLE ELECTRONIC DEVICE
A hinge assembly (1) comprising a first row (2) of hinge plates (3a), a second row (4) of hinge plates (3b) being offset in relation to the first row (2) of hinge plates (3a) such that a hinge plate (3b) of the second row (4) partially overlaps a hinge plate (3a) of the first row (2), and a support rod (5a, 5b). Each support rod (5a, 5b) passes through a hinge plate (3a, 3b) of one row and borders a neighboring hinge plate (3b, 3a) of another row, so that the neighboring hinge plate (3b, 3a) can fold around the support rod (5a, 5b). The hinge assembly (1) has as small outer dimensions as possible, while still providing a range of movement which allows a wide range of movement as well as provides support for any component extending across the hinge assembly (1).
HINGE ASSEMBLY FOR A FOLDABLE ELECTRONIC DEVICE
SCHARNIERANORDNUNG FÜR EINE KLAPPBARE ELEKTRONISCHE VORRICHTUNG
ENSEMBLE CHARNIÈRE POUR UN DISPOSITIF ÉLECTRONIQUE PLIABLE
HEISKANEN JUUSO (author)
2020-11-18
Patent
Electronic Resource
English
BIDIRECTIONALLY FOLDABLE HINGE ASSEMBLY FOR ELECTRONIC DEVICE
| European Patent Office | 2024
BIDIRECTIONALLY FOLDABLE HINGE ASSEMBLY FOR ELECTRONIC DEVICE
| European Patent Office | 2021