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FAUCET FIXTURE
Provided is a faucet fixture to which antifouling functionality is imparted without causing localized corrosion. The present invention is a faucet fixture comprising a metal base material and a plating layer partially formed on the surface of the metal base material. The metal base material contains at least one metal element species selected from the group consisting of copper, zinc, and tin. The plating layer contains at least one metal element species selected from the group consisting of chromium and nickel. An organic layer is further provided on the plating layer, with a passive layer present on the surface of the plating layer being interposed therebetween. The organic layer is bonded to the passive layer via the bonding of a metal element (M), which constitutes the passive layer, and a phosphorus atom (P) in at least one type of group (X) selected from the group consisting of phosphonate groups, phosphate groups, and phosphinate groups, with an oxygen atom (O) interposed therebetween (M-O-P bond). Group X is bonded to a group R (wherein R is a hydrocarbon group, or a group comprising an atom other than carbon at one or two locations within a hydrocarbon group). The phosphorus atom concentration in the portion of the surface of the metal base material on which the plating layer is not formed is lower than the phosphorus atom concentration in the organic layer provided on the plating layer.
FAUCET FIXTURE
Provided is a faucet fixture to which antifouling functionality is imparted without causing localized corrosion. The present invention is a faucet fixture comprising a metal base material and a plating layer partially formed on the surface of the metal base material. The metal base material contains at least one metal element species selected from the group consisting of copper, zinc, and tin. The plating layer contains at least one metal element species selected from the group consisting of chromium and nickel. An organic layer is further provided on the plating layer, with a passive layer present on the surface of the plating layer being interposed therebetween. The organic layer is bonded to the passive layer via the bonding of a metal element (M), which constitutes the passive layer, and a phosphorus atom (P) in at least one type of group (X) selected from the group consisting of phosphonate groups, phosphate groups, and phosphinate groups, with an oxygen atom (O) interposed therebetween (M-O-P bond). Group X is bonded to a group R (wherein R is a hydrocarbon group, or a group comprising an atom other than carbon at one or two locations within a hydrocarbon group). The phosphorus atom concentration in the portion of the surface of the metal base material on which the plating layer is not formed is lower than the phosphorus atom concentration in the organic layer provided on the plating layer.
FAUCET FIXTURE
WASSERHAHNARMATUR
ACCESSOIRE DE ROBINET
KOGA RYO (author) / UKIGAI SAORI (author) / HIJIKATA RYOJIRO (author)
2022-01-19
Patent
Electronic Resource
English
IPC:
E03C
DOMESTIC PLUMBING INSTALLATIONS FOR FRESH WATER OR WASTE WATER
,
Hausinstallationen für Frisch- oder Abwasser
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
/
C23C
Beschichten metallischer Werkstoffe
,
COATING METALLIC MATERIAL
/
C23G
CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
,
Reinigen oder Entfetten metallischer Werkstoffe durch chemische Verfahren, ausgenommen Elektrolyse
/
C25D
Verfahren für die elektrolytische oder elektrophoretische Herstellung von Überzügen
,
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS