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COPPER/CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, AND METHOD FOR PRODUCING COPPER/CERAMIC BONDED BODY, AND METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD
A copper/ceramic bonded body includes: a copper member (22) made of copper or a copper alloy; and a ceramic member (11) made of an aluminum oxide, wherein the copper member (22) and the ceramic member (11) are bonded to each other, a magnesium oxide layer (31) is provided on a ceramic member (11) side of an interface between the copper member (22) and the ceramic member (11); and a Mg solid solution layer (32) is provided between the magnesium oxide layer (31) and the copper member (22) and contains Mg in a state of a solid solution in a Cu primary phase.
COPPER/CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, AND METHOD FOR PRODUCING COPPER/CERAMIC BONDED BODY, AND METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD
A copper/ceramic bonded body includes: a copper member (22) made of copper or a copper alloy; and a ceramic member (11) made of an aluminum oxide, wherein the copper member (22) and the ceramic member (11) are bonded to each other, a magnesium oxide layer (31) is provided on a ceramic member (11) side of an interface between the copper member (22) and the ceramic member (11); and a Mg solid solution layer (32) is provided between the magnesium oxide layer (31) and the copper member (22) and contains Mg in a state of a solid solution in a Cu primary phase.
COPPER/CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, AND METHOD FOR PRODUCING COPPER/CERAMIC BONDED BODY, AND METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD
KUPFER-KERAMIK-FÜGEKÖRPER, ISOLIERTE LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG EINES KUPFER-KERAMIK-FÜGEKÖRPERS SOWIE VERFAHREN ZUR HERSTELLUNG EINER ISOLIERTEN LEITERPLATTE
CORPS ASSEMBLÉ EN CUIVRE/CÉRAMIQUE, CARTE DE CIRCUIT IMPRIMÉ ISOLÉE, ET PROCÉDÉ DE PRODUCTION DE CORPS ASSEMBLÉ EN CUIVRE/CÉRAMIQUE, ET PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ ISOLÉE
TERASAKI NOBUYUKI (author)
2022-06-08
Patent
Electronic Resource
English
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