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LEAD-FREE LOW-MELTING GLASS COMPOSITION AND LOW-MELTING GLASS COMPOSITE MATERIAL AND LOW-MELTING GLASS PASTE CONTAINING LEAD-FREE LOW-MELTING GLASS COMPOSITION, AND SEALING STRUCTURE, ELECTRIC/ELECTRONIC PART AND COATED PART USING SAME
A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides. Ag2O≧TeO2≧V2O5≧Li2O2V2O5≧Ag2O+Li2O≧40 (In the formula, [X] represents a content of component X, and the unit thereof is "mol%"; the same applies hereinafter.) Thus, it is possible to provide a lead-free low-melting glass composition which enables sealing and adhesion at around the melting point (232 °C) of tin and which has high adhesiveness and stickiness.
LEAD-FREE LOW-MELTING GLASS COMPOSITION AND LOW-MELTING GLASS COMPOSITE MATERIAL AND LOW-MELTING GLASS PASTE CONTAINING LEAD-FREE LOW-MELTING GLASS COMPOSITION, AND SEALING STRUCTURE, ELECTRIC/ELECTRONIC PART AND COATED PART USING SAME
A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides. Ag2O≧TeO2≧V2O5≧Li2O2V2O5≧Ag2O+Li2O≧40 (In the formula, [X] represents a content of component X, and the unit thereof is "mol%"; the same applies hereinafter.) Thus, it is possible to provide a lead-free low-melting glass composition which enables sealing and adhesion at around the melting point (232 °C) of tin and which has high adhesiveness and stickiness.
LEAD-FREE LOW-MELTING GLASS COMPOSITION AND LOW-MELTING GLASS COMPOSITE MATERIAL AND LOW-MELTING GLASS PASTE CONTAINING LEAD-FREE LOW-MELTING GLASS COMPOSITION, AND SEALING STRUCTURE, ELECTRIC/ELECTRONIC PART AND COATED PART USING SAME
BLEIFREIE NIEDRIGSCHMELZENDE GLASZUSAMMENSETZUNG UND NIEDRIGSCHMELZENDES GLASVERBUNDMATERIAL UND NIEDRIGSCHMELZENDE GLASPASTE, DIE EINE BLEIFREIE NIEDRIGSCHMELZENDE GLASZUSAMMENSETZUNG ENTHÄLT, UND ABDICHTUNGSSTRUKTUR, ELEKTRISCHES/ELEKTRONISCHES TEIL UND BESCHICHTETES TEIL, DAS DIESELBE VERWENDET
COMPOSITION DE VERRE À BAS POINT DE FUSION SANS PLOMB ET MATÉRIAU COMPOSITE DE VERRE À BAS POINT DE FUSION ET PÂTE DE VERRE À BAS POINT DE FUSION CONTENANT UNE COMPOSITION DE VERRE À BAS POINT DE FUSION SANS PLOMB, ET UNE STRUCTURE D'ÉTANCHÉITÉ, UNE PIÈCE ÉLECTRIQUE/ÉLECTRONIQUE ET UNE PARTIE REVÊTUE L'UTILISANT
NAITO TAKASHI (author) / TACHIZONO SHINICHI (author) / HASHIBA YUJI (author) / MIYAKE TATSUYA (author) / ONODERA TAIGO (author) / AOYAGI TAKUYA (author)
2024-10-09
Patent
Electronic Resource
English
Heat-insulating member, low-melting glass composition, and sealing material paste
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