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DIAMOND CUTTING TOOL AND PRODUCTION METHOD THEREFOR
There is provided a diamond cutting tool including a cutting edge portion containing single crystal diamond or binderless polycrystalline diamond and graphite, wherein when Raman spectroscopy is performed on a surface of the cutting edge portion, a ratio R1 of Ig1 to a sum of Id1 and the Ig1 is equal to or more than 0.5 and equal to or less than 1, where the Id1 represents a peak intensity of first carbon in the surface, the Ig1 represents a peak intensity of second carbon in the surface, the first carbon represents carbon that forms the single crystal diamond or the binderless polycrystalline diamond, and the second carbon represents carbon that forms the graphite, and when Raman spectroscopy is performed on a plane located at a depth of 1 µm from the surface, a ratio R2 of Ig2 to a sum of Id2 and the Ig2 is equal to or more than 0.01 and equal to or less than 0.3, where the Id2 represents a peak intensity of the first carbon in the plane located at the depth of 1 µm from the surface, and the Ig2 represents a peak intensity of the second carbon in the plane located at the depth of 1 µm from the surface.
DIAMOND CUTTING TOOL AND PRODUCTION METHOD THEREFOR
There is provided a diamond cutting tool including a cutting edge portion containing single crystal diamond or binderless polycrystalline diamond and graphite, wherein when Raman spectroscopy is performed on a surface of the cutting edge portion, a ratio R1 of Ig1 to a sum of Id1 and the Ig1 is equal to or more than 0.5 and equal to or less than 1, where the Id1 represents a peak intensity of first carbon in the surface, the Ig1 represents a peak intensity of second carbon in the surface, the first carbon represents carbon that forms the single crystal diamond or the binderless polycrystalline diamond, and the second carbon represents carbon that forms the graphite, and when Raman spectroscopy is performed on a plane located at a depth of 1 µm from the surface, a ratio R2 of Ig2 to a sum of Id2 and the Ig2 is equal to or more than 0.01 and equal to or less than 0.3, where the Id2 represents a peak intensity of the first carbon in the plane located at the depth of 1 µm from the surface, and the Ig2 represents a peak intensity of the second carbon in the plane located at the depth of 1 µm from the surface.
DIAMOND CUTTING TOOL AND PRODUCTION METHOD THEREFOR
DIAMANTSCHNEIDWERKZEUG UND HERSTELLUNGSVERFAHREN DAFÜR
OUTIL DE TAILLE DE DIAMANT ET PROCÉDÉ DE FABRICATION ASSOCIÉ
UEDA AKIHIKO (author) / WATANOBE NAOKI (author) / KUKINO SATORU (author)
2022-12-21
Patent
Electronic Resource
English
IPC:
B23B
Drehen
,
TURNING
/
B23K
Löten
,
SOLDERING OR UNSOLDERING
/
B23P
Sonstige Metallbearbeitung
,
OTHER WORKING OF METAL
/
B28D
Bearbeiten von Stein oder steinähnlichen Werkstoffen
,
WORKING STONE OR STONE-LIKE MATERIALS
/
C01B
NON-METALLIC ELEMENTS
,
Nichtmetallische Elemente
/
C04B
Kalk
,
LIME
/
C30B
SINGLE-CRYSTAL GROWTH
,
Züchten von Einkristallen
| European Patent Office | 2015
| European Patent Office | 2022
| European Patent Office | 2016
| European Patent Office | 2018