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DIAMOND SINTERED BODY AND TOOL PROVIDED WITH DIAMOND SINTERED BODY
A diamond sintered material includes diamond grains, wherein a content ratio of the diamond grains is more than or equal to 80 volume% and less than or equal to 99 volume% with respect to the diamond sintered material, an average grain size of the diamond grains is more than or equal to 0.1 µm and less than or equal to 50 µm, and a dislocation density of the diamond grains is more than or equal to 8.1×1013 m-2 and less than 1.0×1016 m-2.
DIAMOND SINTERED BODY AND TOOL PROVIDED WITH DIAMOND SINTERED BODY
A diamond sintered material includes diamond grains, wherein a content ratio of the diamond grains is more than or equal to 80 volume% and less than or equal to 99 volume% with respect to the diamond sintered material, an average grain size of the diamond grains is more than or equal to 0.1 µm and less than or equal to 50 µm, and a dislocation density of the diamond grains is more than or equal to 8.1×1013 m-2 and less than 1.0×1016 m-2.
DIAMOND SINTERED BODY AND TOOL PROVIDED WITH DIAMOND SINTERED BODY
DIAMANTSINTERKÖRPER UND WERKZEUG MIT DEM DIAMANTSINTERKÖRPER
CORPS FRITTÉ DE DIAMANT, ET OUTIL ÉQUIPÉ DE CELUI-CI
UEDA AKIHIKO (author) / HIRAI KEI (author) / IWASAKI HIROTSUGU (author) / MATSUKAWA MICHIKO (author) / KUKINO SATORU (author)
2023-11-29
Patent
Electronic Resource
English
IPC:
B23B
Drehen
,
TURNING
/
B01J
Chemische oder physikalische Verfahren, z.B. Katalyse oder Kolloidchemie
,
CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY
/
B22F
Verarbeiten von Metallpulver
,
WORKING METALLIC POWDER
/
C01B
NON-METALLIC ELEMENTS
,
Nichtmetallische Elemente
/
C04B
Kalk
,
LIME
/
C22C
Legierungen
,
ALLOYS
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