A platform for research: civil engineering, architecture and urbanism
The present disclosure relates to modular building unit, comprising at least a floor frame, a ceiling frame and a plurality of uprights defining a vertical offset between the floor frame and the ceiling frame, wherein an outer circumference of one of the ceiling frame and the floor frame is undersized relative to an inner circumference of the other one of the ceiling frame and the floor frame, such that the one of the ceiling frame and the floor frame having the relatively undersized outer circumference may be internally received by the other one of the ceiling frame and the floor frame of an overlaying further modular building unit that is stacked on top of the modular building unit.
The present disclosure relates to modular building unit, comprising at least a floor frame, a ceiling frame and a plurality of uprights defining a vertical offset between the floor frame and the ceiling frame, wherein an outer circumference of one of the ceiling frame and the floor frame is undersized relative to an inner circumference of the other one of the ceiling frame and the floor frame, such that the one of the ceiling frame and the floor frame having the relatively undersized outer circumference may be internally received by the other one of the ceiling frame and the floor frame of an overlaying further modular building unit that is stacked on top of the modular building unit.
MODULAR BUILDING UNIT
MODULARE BAUEINHEIT
UNITÉ DE CONSTRUCTION MODULAIRE
VOS XANDER LAURENZ (author)
2024-03-27
Patent
Electronic Resource
English
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS