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DOUBLE DIELECTRIC COVER LAYERS COMPRISING FLUORINE FOR A MULTILAYER CERAMIC COMPONENT
A multilayer electronic component (100) includes a body (110) including a capacitance formation portion (Ac) including a dielectric layer (111) and an internal electrode (121, 122) alternately disposed in a first direction, and a cover portion (112, 113) disposed on both end surfaces of the capacitance formation portion (Ac) opposing each other in the first direction, and an external electrode (131, 132) disposed on the outside of the body (110) and connected to the internal electrode (121, 122). The cover portion (112, 113) has a first region (112a, 113a), adjacent to the capacitance formation portion (Ac), and a second region (112b, 113b), adjacent to the outside of the cover portion. A content of fluorine (F) included in each of the second regions (112b) and (113b) may be greater than a content of fluorine (F) included in each of the first regions (112a) and (113a), respectively. The fluorine (F) included in the second region (112b, 113b) may serves as a low-temperature sintering aid, thereby inducing grain growth and densification of dielectric crystal grains (G2) included in the second region (112b, 113b). Accordingly, the second region (112b, 113b), adjacent to the outside of the cover portion (112) or (113), may have improved toughness to prevent cracks from occurring due to external impacts.
DOUBLE DIELECTRIC COVER LAYERS COMPRISING FLUORINE FOR A MULTILAYER CERAMIC COMPONENT
A multilayer electronic component (100) includes a body (110) including a capacitance formation portion (Ac) including a dielectric layer (111) and an internal electrode (121, 122) alternately disposed in a first direction, and a cover portion (112, 113) disposed on both end surfaces of the capacitance formation portion (Ac) opposing each other in the first direction, and an external electrode (131, 132) disposed on the outside of the body (110) and connected to the internal electrode (121, 122). The cover portion (112, 113) has a first region (112a, 113a), adjacent to the capacitance formation portion (Ac), and a second region (112b, 113b), adjacent to the outside of the cover portion. A content of fluorine (F) included in each of the second regions (112b) and (113b) may be greater than a content of fluorine (F) included in each of the first regions (112a) and (113a), respectively. The fluorine (F) included in the second region (112b, 113b) may serves as a low-temperature sintering aid, thereby inducing grain growth and densification of dielectric crystal grains (G2) included in the second region (112b, 113b). Accordingly, the second region (112b, 113b), adjacent to the outside of the cover portion (112) or (113), may have improved toughness to prevent cracks from occurring due to external impacts.
DOUBLE DIELECTRIC COVER LAYERS COMPRISING FLUORINE FOR A MULTILAYER CERAMIC COMPONENT
DOPPELTE DIELEKTRISCHE DECKSCHICHTEN MIT FLUOR FÜR EIN KERAMISCHES MEHRSCHICHTBAUTEIL
COUCHES DE RECOUVREMENT DIÉLECTRIQUES DOUBLES COMPRENANT DU FLUOR POUR UN COMPOSANT CÉRAMIQUE MULTICOUCHE
CHOI HO SAM (author) / SIM KYU JEONG (author) / PARK JUNG JIN (author) / CHOI HYO SUNG (author) / LEE JONG HO (author)
2024-08-21
Patent
Electronic Resource
English
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