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A modular heated panel for heating a building, for example as in-floor heating, has an upper layer 5, first 1 and second 2 middle layers and a lower layer 7. The upper layer 5 comprises a first material such as wood, slate or marble or any other material suitable for floor or wall panels; the first middle layer 1 comprises a second material and has a heating element 3, which may be a nano carbon heating element, received within grooves or channels 4; the second middle layer 6 comprises a thermally and/or electrically insulating material; and the lower layer comprises a fourth material having one or more grooves or channels 8 receiving two power supplying conductors 11. The conductors are externally accessible and are releasably connectable through connectors (12, Fig. 5) to the conductors of a second identical flooring unit. Power can be supplied to multiple panels from a single power source.
A modular heated panel for heating a building, for example as in-floor heating, has an upper layer 5, first 1 and second 2 middle layers and a lower layer 7. The upper layer 5 comprises a first material such as wood, slate or marble or any other material suitable for floor or wall panels; the first middle layer 1 comprises a second material and has a heating element 3, which may be a nano carbon heating element, received within grooves or channels 4; the second middle layer 6 comprises a thermally and/or electrically insulating material; and the lower layer comprises a fourth material having one or more grooves or channels 8 receiving two power supplying conductors 11. The conductors are externally accessible and are releasably connectable through connectors (12, Fig. 5) to the conductors of a second identical flooring unit. Power can be supplied to multiple panels from a single power source.
Underfloor heating
LAWRENCE YEUNG (author)
2018-01-24
Patent
Electronic Resource
English