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CERAMIC SINTERED BODY AND PACKAGE
PROBLEM TO BE SOLVED: To provide a ceramic sintered body having low reflectance, high thermal conductivity, high thermal expansion coefficient and high insulating resistance, and to provide a package using the same.SOLUTION: There is provided a ceramic sintered body which contains magnesium oxide as a main component, a main material containing 2 to 10 mass% of a rare earth element(RE) in terms of REOand 0.1 to 2.0 pts.mass of molybdenum in terms of MoObased on 100 pts.mass of the main material. There is provided a package comprising the ceramic sintered body as an insulation substrate 3. Thus, there can be obtained a ceramic sintered body having high thermal conductivity, high thermal expansion coefficient, high insulating resistance, and low reflectance and a package.
【課題】反射率が低く、熱伝導性、熱膨張係数および絶縁抵抗の高いセラミック焼結体とこれを用いたパッケージを提供する。【解決手段】酸化マグネシウムを主成分とし、希土類元素(RE)をRE2O3換算で2〜10質量%含有する主材とともに、該主材を100質量部としたときに、モリブデンをMoO3換算で0.1〜2.0質量部含有する。パッケージは上記のセラミック焼結体を絶縁基体3として備えている。これにより熱伝導率、熱膨張率および絶縁抵抗が高く、反射率の低いセラミック焼結体およびパッケージを得ることができる。【選択図】図1
CERAMIC SINTERED BODY AND PACKAGE
PROBLEM TO BE SOLVED: To provide a ceramic sintered body having low reflectance, high thermal conductivity, high thermal expansion coefficient and high insulating resistance, and to provide a package using the same.SOLUTION: There is provided a ceramic sintered body which contains magnesium oxide as a main component, a main material containing 2 to 10 mass% of a rare earth element(RE) in terms of REOand 0.1 to 2.0 pts.mass of molybdenum in terms of MoObased on 100 pts.mass of the main material. There is provided a package comprising the ceramic sintered body as an insulation substrate 3. Thus, there can be obtained a ceramic sintered body having high thermal conductivity, high thermal expansion coefficient, high insulating resistance, and low reflectance and a package.
【課題】反射率が低く、熱伝導性、熱膨張係数および絶縁抵抗の高いセラミック焼結体とこれを用いたパッケージを提供する。【解決手段】酸化マグネシウムを主成分とし、希土類元素(RE)をRE2O3換算で2〜10質量%含有する主材とともに、該主材を100質量部としたときに、モリブデンをMoO3換算で0.1〜2.0質量部含有する。パッケージは上記のセラミック焼結体を絶縁基体3として備えている。これにより熱伝導率、熱膨張率および絶縁抵抗が高く、反射率の低いセラミック焼結体およびパッケージを得ることができる。【選択図】図1
CERAMIC SINTERED BODY AND PACKAGE
セラミック焼結体およびたパッケージ
YAMAMOTO KOJI (author) / TERAO SHINYA (author)
2015-08-24
Patent
Electronic Resource
Japanese
IPC:
C04B
Kalk
,
LIME
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