A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METHOD FOR JOINING CERAMIC TO METAL, AND SEALING STRUCTURE THEREOF
PROBLEM TO BE SOLVED: To provide a method for joining a metal component to a ceramic component, which is optimal for sealing a high temperature electrochemical cell.SOLUTION: A method for joining a metal component 210 to a ceramic component 204 includes disposing a metallic barrier layer 208 on a metallized portion of the ceramic component 204, and joining the metal component to the metallized portion of the ceramic component 204 through the metallic barrier layer 208. The metallic barrier layer 208 comprises nickel and a melting point depressant. The metallic barrier layer 208 is disposed by a screen printing process, followed by sintering the layer at a temperature less than about 1000 degrees Celsius.SELECTED DRAWING: Figure 2
【課題】高温の電気化学セルを封止するために最適な、金属構成要素とセラミック構成要素を接合するための方法の提供。【解決手段】セラミック構成要素２０４のメタライズ部分の上に金属性のバリア層２０８を配置し、その金属性のバリア層２０８を介して、セラミック構成要素２０４のメタライズ部分に金属構成要素２１０を接合する方法。金属性のバリア層２０８は、ニッケルおよび融点降下剤を含み、金属性のバリア層２０８は、スクリーン印刷プロセスによって配置され、引き続き、層をセ氏約１０００度未満の温度で焼結する金属とセラミックとの構成要素を接合する方法。【選択図】図２
METHOD FOR JOINING CERAMIC TO METAL, AND SEALING STRUCTURE THEREOF
PROBLEM TO BE SOLVED: To provide a method for joining a metal component to a ceramic component, which is optimal for sealing a high temperature electrochemical cell.SOLUTION: A method for joining a metal component 210 to a ceramic component 204 includes disposing a metallic barrier layer 208 on a metallized portion of the ceramic component 204, and joining the metal component to the metallized portion of the ceramic component 204 through the metallic barrier layer 208. The metallic barrier layer 208 comprises nickel and a melting point depressant. The metallic barrier layer 208 is disposed by a screen printing process, followed by sintering the layer at a temperature less than about 1000 degrees Celsius.SELECTED DRAWING: Figure 2
【課題】高温の電気化学セルを封止するために最適な、金属構成要素とセラミック構成要素を接合するための方法の提供。【解決手段】セラミック構成要素２０４のメタライズ部分の上に金属性のバリア層２０８を配置し、その金属性のバリア層２０８を介して、セラミック構成要素２０４のメタライズ部分に金属構成要素２１０を接合する方法。金属性のバリア層２０８は、ニッケルおよび融点降下剤を含み、金属性のバリア層２０８は、スクリーン印刷プロセスによって配置され、引き続き、層をセ氏約１０００度未満の温度で焼結する金属とセラミックとの構成要素を接合する方法。【選択図】図２
METHOD FOR JOINING CERAMIC TO METAL, AND SEALING STRUCTURE THEREOF
セラミックと金属を接合するための方法およびその封止構造
SUNDEEP KUMAR (author) / RAHMANE MOHAMED (author) / HONGBO CAO (author) / DARREN MICHAEL STOHR (author) / RAGHAVENDRA RAO ADHARAPURAPU (author) / HANUMANTHA RAVIKUMAR (author)
2016-02-25
Patent
Electronic Resource
Japanese
Method for joining ceramic to metal, and sealing structure thereof
| European Patent Office | 2018
METHOD FOR JOINING CERAMIC TO METAL AND SEALING STRUCTURE THEREOF
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