A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METAL-CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING THE SAME
PROBLEM TO BE SOLVED: To provide a metal-ceramic circuit board in which the generation of migration can be sufficiently suppressed in a metal-ceramic circuit board obtained by joining a metal plate to a ceramic board by an active metal-containing brazing filler metal, and a method for producing the same.SOLUTION: In a metal-ceramic circuit board obtained by joining a metal board 14 to a ceramic board 10 by an active metal-containing brazing filler metal 12, a reaction product layer 12a made of a reaction product mainly between the active metal of an active metal-containing brazing filler metal and a ceramic of a ceramic board is formed on the ceramic board, a metal layer 12 mainly made of a metal other than the active metal of an active metal-containing brazing filler metal is formed between the reaction product and the metal plate, the reaction product layer swells from the side faces of the metal layer to form a fillet, and a plating film is formed on the exposed face of the metal layer and the reaction product layer (preferably, the reaction product layer between the metal plate and the metal layer).SELECTED DRAWING: Figure 1K
【課題】活性金属含有ろう材によりセラミックス基板に金属板を接合した金属−セラミックス回路基板において、マイグレーションの発生を十分に抑制することができる、金属−セラミックス回路基板およびその製造方法を提供する。【解決手段】活性金属含有ろう材１２によりセラミックス基板１０に金属板１４が接合した金属−セラミックス回路基板において、主に活性金属含有ろう材の活性金属とセラミックス基板のセラミックスとの反応生成物からなる反応生成物層１２ａがセラミックス基板上に形成され、主に活性金属含有ろう材の活性金属以外の金属からなる金属層１２ｂが反応生成物と金属板との間に形成され、反応生成物層が金属層の側面からはみ出してフィレットを形成し、金属層と反応生成物層（好ましくは金属板と金属層と反応生成物層）の露出面にめっき皮膜が形成されている。【選択図】図１Ｋ
METAL-CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING THE SAME
PROBLEM TO BE SOLVED: To provide a metal-ceramic circuit board in which the generation of migration can be sufficiently suppressed in a metal-ceramic circuit board obtained by joining a metal plate to a ceramic board by an active metal-containing brazing filler metal, and a method for producing the same.SOLUTION: In a metal-ceramic circuit board obtained by joining a metal board 14 to a ceramic board 10 by an active metal-containing brazing filler metal 12, a reaction product layer 12a made of a reaction product mainly between the active metal of an active metal-containing brazing filler metal and a ceramic of a ceramic board is formed on the ceramic board, a metal layer 12 mainly made of a metal other than the active metal of an active metal-containing brazing filler metal is formed between the reaction product and the metal plate, the reaction product layer swells from the side faces of the metal layer to form a fillet, and a plating film is formed on the exposed face of the metal layer and the reaction product layer (preferably, the reaction product layer between the metal plate and the metal layer).SELECTED DRAWING: Figure 1K
【課題】活性金属含有ろう材によりセラミックス基板に金属板を接合した金属−セラミックス回路基板において、マイグレーションの発生を十分に抑制することができる、金属−セラミックス回路基板およびその製造方法を提供する。【解決手段】活性金属含有ろう材１２によりセラミックス基板１０に金属板１４が接合した金属−セラミックス回路基板において、主に活性金属含有ろう材の活性金属とセラミックス基板のセラミックスとの反応生成物からなる反応生成物層１２ａがセラミックス基板上に形成され、主に活性金属含有ろう材の活性金属以外の金属からなる金属層１２ｂが反応生成物と金属板との間に形成され、反応生成物層が金属層の側面からはみ出してフィレットを形成し、金属層と反応生成物層（好ましくは金属板と金属層と反応生成物層）の露出面にめっき皮膜が形成されている。【選択図】図１Ｋ
METAL-CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING THE SAME
金属−セラミックス回路基板およびその製造方法
KOBAYASHI KOJI (author) / SAWABE AKIO (author) / IDENO TAKASHI (author) / FURO MASAHIRO (author)
2016-05-12
Patent
Electronic Resource
Japanese
Metal/ceramic circuit board and method for producing same
| European Patent Office | 2018