A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
CONNECTION BODY, HONEYCOMB STRUCTURE, METHOD FOR PRODUCING CONNECTION BODY AND COATING BODY
PROBLEM TO BE SOLVED: To provide a new connection body having good conductivity.SOLUTION: There is provided a connection body 20 which comprises a first member 22 having a thermal expansion coefficient of 8 ppm/K or less, a second member 24 having a thermal expansion coefficient of 12 ppm/K or more and a connection part 30 which is composed of a conductive oxide containing 50 mass% or more of a spinel-type ferrite phase and connects the first member and the second member. The conductive oxide preferably contains Fe and an element A (provided that the element A is one or more selected from the group consisting of Mg, Mn, Co, Ni, Cu and Zn) and the molar ratio A/Fe of the element A to Fe is more preferably 0.5 or less.SELECTED DRAWING: Figure 1
【課題】導電性の良好な新規な接合体を提供する。【解決手段】接合体２０は、熱膨張係数が８ｐｐｍ／Ｋ以下の第１部材２２と、熱膨張係数が１２ｐｐｍ／Ｋ以上の第２部材２４と、スピネル型フェライト相を５０質量％以上含む導電性酸化物で構成され、前記第１部材と前記第２部材とを接合する接合部３０と、を備えている。導電性酸化物は、Ｆｅと元素Ａ（但し元素Ａは、Ｍｇ、Ｍｎ、Ｃｏ、Ｎｉ、Ｃｕ、Ｚｎからなる群より選ばれる１以上）とを含むものであることが好ましく、Ｆｅに対する元素Ａのモル比Ａ／Ｆｅが０．５以下であることがより好ましい。【選択図】図１
CONNECTION BODY, HONEYCOMB STRUCTURE, METHOD FOR PRODUCING CONNECTION BODY AND COATING BODY
PROBLEM TO BE SOLVED: To provide a new connection body having good conductivity.SOLUTION: There is provided a connection body 20 which comprises a first member 22 having a thermal expansion coefficient of 8 ppm/K or less, a second member 24 having a thermal expansion coefficient of 12 ppm/K or more and a connection part 30 which is composed of a conductive oxide containing 50 mass% or more of a spinel-type ferrite phase and connects the first member and the second member. The conductive oxide preferably contains Fe and an element A (provided that the element A is one or more selected from the group consisting of Mg, Mn, Co, Ni, Cu and Zn) and the molar ratio A/Fe of the element A to Fe is more preferably 0.5 or less.SELECTED DRAWING: Figure 1
【課題】導電性の良好な新規な接合体を提供する。【解決手段】接合体２０は、熱膨張係数が８ｐｐｍ／Ｋ以下の第１部材２２と、熱膨張係数が１２ｐｐｍ／Ｋ以上の第２部材２４と、スピネル型フェライト相を５０質量％以上含む導電性酸化物で構成され、前記第１部材と前記第２部材とを接合する接合部３０と、を備えている。導電性酸化物は、Ｆｅと元素Ａ（但し元素Ａは、Ｍｇ、Ｍｎ、Ｃｏ、Ｎｉ、Ｃｕ、Ｚｎからなる群より選ばれる１以上）とを含むものであることが好ましく、Ｆｅに対する元素Ａのモル比Ａ／Ｆｅが０．５以下であることがより好ましい。【選択図】図１
CONNECTION BODY, HONEYCOMB STRUCTURE, METHOD FOR PRODUCING CONNECTION BODY AND COATING BODY
接合体、ハニカム構造体、接合体の製造方法及び被覆体
IZUMI YUNIE (author) / KOBAYASHI YOSHIMASA (author)
2016-10-06
Patent
Electronic Resource
Japanese
IPC:
C04B
Kalk
,
LIME
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