A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
LOW MELTING POINT COMPOSITION, ENCAPSULATING MATERIAL AND ENCAPSULATING METHOD
PROBLEM TO BE SOLVED: To provide a low melting point composition and an encapsulating material exhibiting good flowability with a heat treatment at a temperature of less than 400°C under ambient air, adhering to a surface of a target for encapsulation favourably by subsequent cooling and capable of achieving encapsulation excellent in water resistance.SOLUTION: There is provided a low melting point composition containing Ag, Cl and I as constituents and having (a) the percentage of the molar number of the Ag atom to the sum of molar numbers of all atoms having a positive ionic valency of 40 to 100%, (b) the percentage of the molar number of the Cl atom of 5 to 80% and the molar number of the I atom of 10 to 80% to the sum of molar numbers of all atoms having a negative ionic valency.SELECTED DRAWING: None
【課題】大気下４００℃未満の温度において熱処理するとき，良好なフロー性を示し，その後の冷却で，封止対象の表面によく密着し，また耐水性に優れた封止を達成することのできる，低融点組成物及び封止材の提供。【解決手段】Ａｇ，Ｃｌ，及びＩを構成要素として含んでなる低融点組成物であって，所定質量の該組成物中，（ａ）正のイオン価を有する全原子のモル数の和に対しＡｇ原子のモル数の占める割合が４０〜１００％であり，（ｂ）負のイオン価を有する全原子のモル数の和に対し，Ｃｌ原子のモル数の占める割合が５〜８０％，及びＩ原子のモル数の占める割合が１０〜８０％である，低融点組成物。【選択図】なし
LOW MELTING POINT COMPOSITION, ENCAPSULATING MATERIAL AND ENCAPSULATING METHOD
PROBLEM TO BE SOLVED: To provide a low melting point composition and an encapsulating material exhibiting good flowability with a heat treatment at a temperature of less than 400°C under ambient air, adhering to a surface of a target for encapsulation favourably by subsequent cooling and capable of achieving encapsulation excellent in water resistance.SOLUTION: There is provided a low melting point composition containing Ag, Cl and I as constituents and having (a) the percentage of the molar number of the Ag atom to the sum of molar numbers of all atoms having a positive ionic valency of 40 to 100%, (b) the percentage of the molar number of the Cl atom of 5 to 80% and the molar number of the I atom of 10 to 80% to the sum of molar numbers of all atoms having a negative ionic valency.SELECTED DRAWING: None
【課題】大気下４００℃未満の温度において熱処理するとき，良好なフロー性を示し，その後の冷却で，封止対象の表面によく密着し，また耐水性に優れた封止を達成することのできる，低融点組成物及び封止材の提供。【解決手段】Ａｇ，Ｃｌ，及びＩを構成要素として含んでなる低融点組成物であって，所定質量の該組成物中，（ａ）正のイオン価を有する全原子のモル数の和に対しＡｇ原子のモル数の占める割合が４０〜１００％であり，（ｂ）負のイオン価を有する全原子のモル数の和に対し，Ｃｌ原子のモル数の占める割合が５〜８０％，及びＩ原子のモル数の占める割合が１０〜８０％である，低融点組成物。【選択図】なし
LOW MELTING POINT COMPOSITION, ENCAPSULATING MATERIAL AND ENCAPSULATING METHOD
低融点組成物，封止材，及び封止方法
IKEDA TAKURO (author)
2017-01-26
Patent
Electronic Resource
Japanese
IPC:
C01G
Verbindungen der von den Unterklassen C01D oder C01F nicht umfassten Metalle
,
COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
/
C03C
Chemische Zusammensetzungen für Gläser, Glasuren oder Emails
,
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS
/
C04B
Kalk
,
LIME
/
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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