A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
MANUFACTURING METHOD OF COMPONENT FOR SEMICONDUCTOR MANUFACTURE, AND COMPONENT FOR SEMICONDUCTOR MANUFACTURE
PROBLEM TO BE SOLVED: To provide a manufacturing method of a component for semiconductor manufacture capable of easily manufacturing a portion for semiconductor manufacture in which gas leakage or the like is unlikely to occur, and the component for semiconductor manufacture.SOLUTION: When manufacturing a heating apparatus 1, a groove 21 that becomes a middle gas passage 19 is formed on a surface of a second green sheet laminate 55, a composite laminate 57 is configured by laminating a second green sheet laminate 53 so as to cover the surface of the second green sheet laminate 55 on which the groove 21 is formed, and outer periphery processing is applied in such a manner that an opening 23 of the middle gas passage 19 is exposed on the composite laminate 57. A main body plate 3 is then created by calcination on predetermined conditions and joined with a support part 5, such that the heating apparatus 1 is manufactured. Therefore, a manufacture process can be simplified. In the case of calcination, both the green sheet laminates 53 and 55 are firmly joined and integrated in the state where the groove 21 is formed, thereby preventing a gas from being leaked from a gap of ceramic plates.SELECTED DRAWING: Figure 5
【課題】ガス漏れ等が生じにくい半導体製造用部分を容易に製造できる半導体製造用部品の製造方法及び半導体製造用部品を提供すること。【解決手段】加熱装置１を製造する場合には、第２グリーンシート積層体５５の表面に中ガス流路１９となる溝２１を形成し、溝２１が形成された第２グリーンシート積層体５５の表面を覆うように、第１グリーンシート積層体５３を積層して複合積層体５７し、その複合積層体５７に中ガス流路１９の開口部２３が露出するように外周加工を施す。その後、所定の条件にて焼成して本体プレート３を作製し、支持部５と接合して加熱装置１を製造する。従って、製造工程を簡易化することができる。また、焼成の際に、両グリーンシート積層体５３、５５同士は、溝２１が形成された状態で強固に接合して一体化するので、セラミック板の隙間からガスがリークすることを抑制できる。【選択図】図５
MANUFACTURING METHOD OF COMPONENT FOR SEMICONDUCTOR MANUFACTURE, AND COMPONENT FOR SEMICONDUCTOR MANUFACTURE
PROBLEM TO BE SOLVED: To provide a manufacturing method of a component for semiconductor manufacture capable of easily manufacturing a portion for semiconductor manufacture in which gas leakage or the like is unlikely to occur, and the component for semiconductor manufacture.SOLUTION: When manufacturing a heating apparatus 1, a groove 21 that becomes a middle gas passage 19 is formed on a surface of a second green sheet laminate 55, a composite laminate 57 is configured by laminating a second green sheet laminate 53 so as to cover the surface of the second green sheet laminate 55 on which the groove 21 is formed, and outer periphery processing is applied in such a manner that an opening 23 of the middle gas passage 19 is exposed on the composite laminate 57. A main body plate 3 is then created by calcination on predetermined conditions and joined with a support part 5, such that the heating apparatus 1 is manufactured. Therefore, a manufacture process can be simplified. In the case of calcination, both the green sheet laminates 53 and 55 are firmly joined and integrated in the state where the groove 21 is formed, thereby preventing a gas from being leaked from a gap of ceramic plates.SELECTED DRAWING: Figure 5
【課題】ガス漏れ等が生じにくい半導体製造用部分を容易に製造できる半導体製造用部品の製造方法及び半導体製造用部品を提供すること。【解決手段】加熱装置１を製造する場合には、第２グリーンシート積層体５５の表面に中ガス流路１９となる溝２１を形成し、溝２１が形成された第２グリーンシート積層体５５の表面を覆うように、第１グリーンシート積層体５３を積層して複合積層体５７し、その複合積層体５７に中ガス流路１９の開口部２３が露出するように外周加工を施す。その後、所定の条件にて焼成して本体プレート３を作製し、支持部５と接合して加熱装置１を製造する。従って、製造工程を簡易化することができる。また、焼成の際に、両グリーンシート積層体５３、５５同士は、溝２１が形成された状態で強固に接合して一体化するので、セラミック板の隙間からガスがリークすることを抑制できる。【選択図】図５
MANUFACTURING METHOD OF COMPONENT FOR SEMICONDUCTOR MANUFACTURE, AND COMPONENT FOR SEMICONDUCTOR MANUFACTURE
半導体製造用部品の製造方法及び半導体製造用部品
MITSUYA KOHEI (author) / OGAWA TAKAMICHI (author)
2017-02-16
Patent
Electronic Resource
Japanese
MANUFACTURE OF A MICROFLUIDIC COMPONENT BY ADDITIVE MANUFACTURING
| European Patent Office | 2020