A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
HEAT INSULATION PANEL
PROBLEM TO BE SOLVED: To provide a heat insulation panel superior in smoothness free from unevenness on upper and lower surfaces caused from a vacuum insulation material, and a cellular porous medium capable of being easily manufactured at low manufacturing cost.SOLUTION: A heat insulation panel 10 includes: a bottom panel 11; and a vacuum insulation material 13 which is disposed on the bottom panel via a cushioning material 12 opening in a thickness direction. The periphery of the vacuum insulation material 13 is filled with a cellular porous medium 14, and the upper plane of the cellular porous medium 14 is covered with a cover material 16 via a tense material 15.SELECTED DRAWING: Figure 1
【課題】製造コストがかかりすぎずに、かつ簡易に製造できる、真空断熱材および発泡材に起因する上下面の凹凸がなく平滑性にすぐれた断熱パネルを提供する。【解決手段】断熱パネル１０は、底板材１１の上に、厚み方向に開口した緩衝材１２を介して、真空断熱材１３が配設されており、真空断熱材１３の周囲に発泡材１４が充填されており、発泡材１４の上面が、抗張材１５を介して、蓋材１６で覆われていることを特徴とする。【選択図】図１
HEAT INSULATION PANEL
PROBLEM TO BE SOLVED: To provide a heat insulation panel superior in smoothness free from unevenness on upper and lower surfaces caused from a vacuum insulation material, and a cellular porous medium capable of being easily manufactured at low manufacturing cost.SOLUTION: A heat insulation panel 10 includes: a bottom panel 11; and a vacuum insulation material 13 which is disposed on the bottom panel via a cushioning material 12 opening in a thickness direction. The periphery of the vacuum insulation material 13 is filled with a cellular porous medium 14, and the upper plane of the cellular porous medium 14 is covered with a cover material 16 via a tense material 15.SELECTED DRAWING: Figure 1
【課題】製造コストがかかりすぎずに、かつ簡易に製造できる、真空断熱材および発泡材に起因する上下面の凹凸がなく平滑性にすぐれた断熱パネルを提供する。【解決手段】断熱パネル１０は、底板材１１の上に、厚み方向に開口した緩衝材１２を介して、真空断熱材１３が配設されており、真空断熱材１３の周囲に発泡材１４が充填されており、発泡材１４の上面が、抗張材１５を介して、蓋材１６で覆われていることを特徴とする。【選択図】図１
HEAT INSULATION PANEL
断熱パネル
TODA MASAKAZU (author) / KUDO TAKESHI (author)
2017-03-23
Patent
Electronic Resource
Japanese
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS
HEAT INSULATION PANEL AND HEAT INSULATION PANEL ATTACHING METHOD
| European Patent Office | 2015