A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT, CIRCUIT BOARD FOR MOUNTING LIGHT-EMITTING ELEMENT, LIGHT-EMITTING ELEMENT MODULE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT
PROBLEM TO BE SOLVED: To provide: a substrate for mounting a light-emitting element, having both high reflection characteristics and high heat dissipation characteristics; a circuit board for mounting a light-emitting element; a light-emitting element module; and a method for manufacturing a substrate for mounting a light-emitting element.SOLUTION: A substrate 3 for mounting a light-emitting element comprises an alumina ceramic which has a relative density of 90% or more and 92% or less, contains Al in a value of 97 mass% or more when calculated as AlOin the total constituent component 100 mass%, and has a porosity of 3% or more and 8% or less, and the substrate also includes a metal layer 2. In addition, a light-emitting element module 10 includes a light-emitting element 4 on the metal layer in the circuit board for mounting a light-emitting element.SELECTED DRAWING: Figure 1
【課題】高い反射特性および高い放熱特性を兼ね備える発光素子実装用基板、発光素子実装用回路基板、発光素子モジュールおよび発光素子実装用基板の製造方法を提供する。【解決手段】発光素子実装用基板３は、相対密度が９０％以上９２％以下であり、構成される全成分１００質量％のうち、ＡｌをＡｌ２Ｏ３に換算した値で９７質量％以上含有し、気孔率が３％以上８％以下であるアルミナ質セラミックスからなり、金属層２を備える。さらに、発光素子モジュール１０は、発光素子実装用回路基板における金属層上に発光素子４を備える。【選択図】図１
SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT, CIRCUIT BOARD FOR MOUNTING LIGHT-EMITTING ELEMENT, LIGHT-EMITTING ELEMENT MODULE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT
PROBLEM TO BE SOLVED: To provide: a substrate for mounting a light-emitting element, having both high reflection characteristics and high heat dissipation characteristics; a circuit board for mounting a light-emitting element; a light-emitting element module; and a method for manufacturing a substrate for mounting a light-emitting element.SOLUTION: A substrate 3 for mounting a light-emitting element comprises an alumina ceramic which has a relative density of 90% or more and 92% or less, contains Al in a value of 97 mass% or more when calculated as AlOin the total constituent component 100 mass%, and has a porosity of 3% or more and 8% or less, and the substrate also includes a metal layer 2. In addition, a light-emitting element module 10 includes a light-emitting element 4 on the metal layer in the circuit board for mounting a light-emitting element.SELECTED DRAWING: Figure 1
【課題】高い反射特性および高い放熱特性を兼ね備える発光素子実装用基板、発光素子実装用回路基板、発光素子モジュールおよび発光素子実装用基板の製造方法を提供する。【解決手段】発光素子実装用基板３は、相対密度が９０％以上９２％以下であり、構成される全成分１００質量％のうち、ＡｌをＡｌ２Ｏ３に換算した値で９７質量％以上含有し、気孔率が３％以上８％以下であるアルミナ質セラミックスからなり、金属層２を備える。さらに、発光素子モジュール１０は、発光素子実装用回路基板における金属層上に発光素子４を備える。【選択図】図１
SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT, CIRCUIT BOARD FOR MOUNTING LIGHT-EMITTING ELEMENT, LIGHT-EMITTING ELEMENT MODULE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT
発光素子実装用基板、発光素子実装用回路基板、発光素子モジュールおよび発光素子実装用基板の製造方法
MATSUSHITA KOJI (author)
2017-04-27
Patent
Electronic Resource
Japanese
| European Patent Office | 2021
| European Patent Office | 2019
LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LIGHT-EMITTING ELEMENT MODULE
| European Patent Office | 2016
SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT, AND LIGHT-EMITTING ELEMENT MODULE
| European Patent Office | 2019
Substrate for mounting light-emitting element, and light-emitting element module
| European Patent Office | 2015