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PROBLEM TO BE SOLVED: To provide a sealing material containing a glass powder and a ceramic powder capable of contributing to reduction in height and downsizing of an airtight package which is suitable for laser sealing of a low thermal expansion substrate such as an alumina substrate and a glass substrate.SOLUTION: There is provided a ceramic powder which precipitates a β-eucryptite solid solution or a β-quartz solid solution as a main crystal phase, has an average particle diameter Dof 20 μm or less and has a negative coefficient of thermal expansion in the temperature range of 30 to 300°C. There is provided a ceramic powder which has a composition comprising, by mol%, 16 to 30% of LiO, 10 to 35% of AlOand 30 to 68% of SiO. There is provided a ceramic powder in which the powder preferably substantially contains no glass phase. There is provided a sealing material using laser sealing which contains the ceramic powder and a glass powder.SELECTED DRAWING: Figure 2
【課題】アルミナ基板、ガラス基板等の低熱膨張基板のレーザー封着に適した、気密パッケージの低背化、小型化に寄与することができる、ガラス粉末とセラミック粉末とを含有する封着材料に関し、粒子径が小さくても、負膨張を示すセラミック粉末の提供。【解決手段】主結晶相として、β−ユークリプタイト又はβ−石英固溶体が析出しており、平均粒子径Ｄ５０が２０μｍ以下であり、且つ３０〜３００℃における熱膨張係数が負であるセラミック粉末。組成として、モル％で、Ｌｉ２Ｏ：１６〜３０％、Ａｌ２Ｏ３：１０〜３５％、ＳｉＯ２：３０〜６８％を含有する、セラミックス粉体。前記粉末が実質的にガラス相を含まないことが好ましい、セラミックス粉末。前記セラミックス粉末と、ガラス粉末を含み、レーザー封着を用いる封着材料。【選択図】図２
PROBLEM TO BE SOLVED: To provide a sealing material containing a glass powder and a ceramic powder capable of contributing to reduction in height and downsizing of an airtight package which is suitable for laser sealing of a low thermal expansion substrate such as an alumina substrate and a glass substrate.SOLUTION: There is provided a ceramic powder which precipitates a β-eucryptite solid solution or a β-quartz solid solution as a main crystal phase, has an average particle diameter Dof 20 μm or less and has a negative coefficient of thermal expansion in the temperature range of 30 to 300°C. There is provided a ceramic powder which has a composition comprising, by mol%, 16 to 30% of LiO, 10 to 35% of AlOand 30 to 68% of SiO. There is provided a ceramic powder in which the powder preferably substantially contains no glass phase. There is provided a sealing material using laser sealing which contains the ceramic powder and a glass powder.SELECTED DRAWING: Figure 2
【課題】アルミナ基板、ガラス基板等の低熱膨張基板のレーザー封着に適した、気密パッケージの低背化、小型化に寄与することができる、ガラス粉末とセラミック粉末とを含有する封着材料に関し、粒子径が小さくても、負膨張を示すセラミック粉末の提供。【解決手段】主結晶相として、β−ユークリプタイト又はβ−石英固溶体が析出しており、平均粒子径Ｄ５０が２０μｍ以下であり、且つ３０〜３００℃における熱膨張係数が負であるセラミック粉末。組成として、モル％で、Ｌｉ２Ｏ：１６〜３０％、Ａｌ２Ｏ３：１０〜３５％、ＳｉＯ２：３０〜６８％を含有する、セラミックス粉体。前記粉末が実質的にガラス相を含まないことが好ましい、セラミックス粉末。前記セラミックス粉末と、ガラス粉末を含み、レーザー封着を用いる封着材料。【選択図】図２
CERAMIC POWDER
セラミック粉末
HIROSE MASAYUKI (author)
2017-11-02
Patent
Electronic Resource
Japanese
| European Patent Office | 2023
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