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PROBLEM TO BE SOLVED: To provide a chemical injecting method capable of preventing reverse flow of a chemical even if an injection pipe and a high pressure packer are removed without waiting for curing of the chemical.SOLUTION: In a chemical injecting method, an injection pipe is inserted into an injection hole drilled in ground, a packer is expanded to close a gap between the injection pipe and the injection hole, a chemical is sent by the injection pipe, and the chemical is injected from a mouth of the injection pipe and injected into the ground. A hardening accelerator is added to the chemical at the mouth of the injection pipe after the end of prescribed injection or just before the end of the injection to form a cured body in the injection hole.SELECTED DRAWING: None
【課題】薬液の硬化を待たずに注入管、高圧パッカーを取り除いても薬液の逆流を防止することを可能にする薬液注入工法を提供する。【解決手段】地盤に穿設した注入孔内に注入管を挿入し、パッカーを膨張させて注入管と注入孔の隙間を閉塞させ、注入管で薬液を送液するとともに注入管の口元から吐出させて地盤に注入する薬液注入工法において、規定の注入の終了後または終了間際に、硬化促進剤を注入管の口元で薬液に添加して注入孔内に硬化体を形成するようにした。【選択図】なし
PROBLEM TO BE SOLVED: To provide a chemical injecting method capable of preventing reverse flow of a chemical even if an injection pipe and a high pressure packer are removed without waiting for curing of the chemical.SOLUTION: In a chemical injecting method, an injection pipe is inserted into an injection hole drilled in ground, a packer is expanded to close a gap between the injection pipe and the injection hole, a chemical is sent by the injection pipe, and the chemical is injected from a mouth of the injection pipe and injected into the ground. A hardening accelerator is added to the chemical at the mouth of the injection pipe after the end of prescribed injection or just before the end of the injection to form a cured body in the injection hole.SELECTED DRAWING: None
【課題】薬液の硬化を待たずに注入管、高圧パッカーを取り除いても薬液の逆流を防止することを可能にする薬液注入工法を提供する。【解決手段】地盤に穿設した注入孔内に注入管を挿入し、パッカーを膨張させて注入管と注入孔の隙間を閉塞させ、注入管で薬液を送液するとともに注入管の口元から吐出させて地盤に注入する薬液注入工法において、規定の注入の終了後または終了間際に、硬化促進剤を注入管の口元で薬液に添加して注入孔内に硬化体を形成するようにした。【選択図】なし
CHEMICAL INJECTING METHOD
薬液注入工法
KOBAYASHI SHINJI (author)
2018-05-10
Patent
Electronic Resource
Japanese
IPC:
E02D
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