A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
To provide a ceramic structure capable of preventing breakage of a ceramic base material caused by thermal expansion of a metallic terminal.SOLUTION: A ceramic structure includes: a ceramic base material 20 with a columnar hole portion 22; a metal electrode layer 30 embedded in the ceramic base material 20; a conductive member 50 that is electrically connected to the metal electrode layer 30 and is embedded in the ceramic base material 20 so as to have an exposed surface 51 where at least portion thereof is exposed from the hole portion 22; a first metallic member 60 that is disposed on the exposed surface 51 of the conductive member 50 and is bonded by a first solder material 70; one or more second metallic members 80 that are disposed on a reverse side of a surface opposed to the exposed surface 51 of the conductive member 50 of the first metallic member 60 and are bonded with the first metallic member 60 by a second solder material 90 having higher ductility than the first solder material 70; and a columnar metallic terminal 40 that is inserted into the hole portion 22 and is bonded with the one or more second metallic members 80 by the second solder material 90.SELECTED DRAWING: Figure 3
【課題】金属端子の熱膨張によるセラミックス基材の破損を防止することが可能なセラミックス構造体の提供。【解決手段】柱状の穴部２２を有するセラミックス基材２０と、セラミックス基材２０内に埋設された金属電極層３０と、金属電極層３０に電気的に接続されておりかつ穴部２２から少なくとも一部が露出する露出面５１を有するようにセラミックス基材２０内に埋設される導電部材５０と、導電部材５０の露出面５１上に配されかつ第１のロウ材７０によって接合されている第１の金属部材６０と、第１の金属部材６０の導電部材５０の露出面５１に対向する面と逆側の面上に配され、かつ第１のロウ材７０よりも展延性が高い第２のロウ材９０よって第１の金属部材６０と接合される１又は複数の第２の金属部材８０と、穴部２２に挿入され、１又は複数の第２の金属部材８０と、第２のロウ材９０によって接合されている柱状の金属端子４０とを含むセラミックス構造体。【選択図】図３
To provide a ceramic structure capable of preventing breakage of a ceramic base material caused by thermal expansion of a metallic terminal.SOLUTION: A ceramic structure includes: a ceramic base material 20 with a columnar hole portion 22; a metal electrode layer 30 embedded in the ceramic base material 20; a conductive member 50 that is electrically connected to the metal electrode layer 30 and is embedded in the ceramic base material 20 so as to have an exposed surface 51 where at least portion thereof is exposed from the hole portion 22; a first metallic member 60 that is disposed on the exposed surface 51 of the conductive member 50 and is bonded by a first solder material 70; one or more second metallic members 80 that are disposed on a reverse side of a surface opposed to the exposed surface 51 of the conductive member 50 of the first metallic member 60 and are bonded with the first metallic member 60 by a second solder material 90 having higher ductility than the first solder material 70; and a columnar metallic terminal 40 that is inserted into the hole portion 22 and is bonded with the one or more second metallic members 80 by the second solder material 90.SELECTED DRAWING: Figure 3
【課題】金属端子の熱膨張によるセラミックス基材の破損を防止することが可能なセラミックス構造体の提供。【解決手段】柱状の穴部２２を有するセラミックス基材２０と、セラミックス基材２０内に埋設された金属電極層３０と、金属電極層３０に電気的に接続されておりかつ穴部２２から少なくとも一部が露出する露出面５１を有するようにセラミックス基材２０内に埋設される導電部材５０と、導電部材５０の露出面５１上に配されかつ第１のロウ材７０によって接合されている第１の金属部材６０と、第１の金属部材６０の導電部材５０の露出面５１に対向する面と逆側の面上に配され、かつ第１のロウ材７０よりも展延性が高い第２のロウ材９０よって第１の金属部材６０と接合される１又は複数の第２の金属部材８０と、穴部２２に挿入され、１又は複数の第２の金属部材８０と、第２のロウ材９０によって接合されている柱状の金属端子４０とを含むセラミックス構造体。【選択図】図３
CERAMIC STRUCTURE
セラミックス構造体
TSUCHIDA ATSUSHI (author)
2018-12-27
Patent
Electronic Resource
Japanese