A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
SOIL FILLING METHOD
To provide a soil filling method which can fill soil more quickly and exhibit higher water block property than conventional methods.SOLUTION: A soil filling method for securing water block property between a bedrock surface 1a and an embankment filled on it comprises: a first lamination step of forming first soil layer 2 with a thickness of 1 to 50 mm on the bedrock surface 1a by spraying first cohesive soil adjusted to have a moisture content equal to or higher than the liquid limit onto the bedrock surface 1a; and a second lamination step of forming second soil layer 3 by laminating a second cohesive soil whose moisture content is equal to or higher than plastic limit and lower than liquid limit and is adjusted to a value between a value low by 5% and a value high by 20% with the optimum moisture content for compaction as a reference on a surface of the first soil layer 2 by thickness of at least 4 cm. Since the first soil layer 2 is formed by spraying the cohesive soil onto the bedrock surface 1a, the cohesive soil easily penetrates and adheres to the bedrock surface 1a compared with a case of coating using a brush and the like.SELECTED DRAWING: Figure 1
【課題】従来の方法よりも、より迅速に土を盛り立てることができ、かつ、より高い遮水性を発揮することができる土の盛り立て方法を提供する。【解決手段】岩盤面１ａとその上に盛立てた盛土との間の遮水性を確保するための土の盛立て方法として、液性限界以上の含水比となるように調整された第１の粘性土を岩盤面１ａに吹き付けて岩盤面１ａ上に１〜５０ｍｍの厚さの第１の土層２を形成する第１の積層工程と、含水比が、塑性限界以上液性限界未満であって、締固めのための最適含水比を基準として５％低い値と２０％高い値との間の値となるように調整された第２の粘性土を第１の土層２の表面に少なくとも４ｃｍの厚さで積層し第２の土層３を形成する第２の積層工程とを有する。粘性土を岩盤面１ａに吹き付けることによって第１の土層２を形成するので、ブラシ等で塗布する場合に比べて粘性土が岩盤面１ａに浸透及び密着しやすい【選択図】図１
SOIL FILLING METHOD
To provide a soil filling method which can fill soil more quickly and exhibit higher water block property than conventional methods.SOLUTION: A soil filling method for securing water block property between a bedrock surface 1a and an embankment filled on it comprises: a first lamination step of forming first soil layer 2 with a thickness of 1 to 50 mm on the bedrock surface 1a by spraying first cohesive soil adjusted to have a moisture content equal to or higher than the liquid limit onto the bedrock surface 1a; and a second lamination step of forming second soil layer 3 by laminating a second cohesive soil whose moisture content is equal to or higher than plastic limit and lower than liquid limit and is adjusted to a value between a value low by 5% and a value high by 20% with the optimum moisture content for compaction as a reference on a surface of the first soil layer 2 by thickness of at least 4 cm. Since the first soil layer 2 is formed by spraying the cohesive soil onto the bedrock surface 1a, the cohesive soil easily penetrates and adheres to the bedrock surface 1a compared with a case of coating using a brush and the like.SELECTED DRAWING: Figure 1
【課題】従来の方法よりも、より迅速に土を盛り立てることができ、かつ、より高い遮水性を発揮することができる土の盛り立て方法を提供する。【解決手段】岩盤面１ａとその上に盛立てた盛土との間の遮水性を確保するための土の盛立て方法として、液性限界以上の含水比となるように調整された第１の粘性土を岩盤面１ａに吹き付けて岩盤面１ａ上に１〜５０ｍｍの厚さの第１の土層２を形成する第１の積層工程と、含水比が、塑性限界以上液性限界未満であって、締固めのための最適含水比を基準として５％低い値と２０％高い値との間の値となるように調整された第２の粘性土を第１の土層２の表面に少なくとも４ｃｍの厚さで積層し第２の土層３を形成する第２の積層工程とを有する。粘性土を岩盤面１ａに吹き付けることによって第１の土層２を形成するので、ブラシ等で塗布する場合に比べて粘性土が岩盤面１ａに浸透及び密着しやすい【選択図】図１
SOIL FILLING METHOD
土の盛立て方法
NASUNO KYONOBU (author) / UEMOTO KATSUHIRO (author) / KOBAYASHI KAZUMI (author) / OKAYAMA MAKOTO (author) / KANBE TAKAYUKI (author) / FUKAMI NORITAKA (author)
2019-06-06
Patent
Electronic Resource
Japanese
IPC:
E02D
FOUNDATIONS
,
Gründungen
BACK-FILLING SYSTEM OF SOIL IN PILE REMOVING, AND BACK-FILLING METHOD OF SOIL
| European Patent Office | 2024