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A platform for research: civil engineering, architecture and urbanism
THERMALLY EXPANDABLE FIREPROOF MATERIAL AND FIREPROOF COMPACT
To provide a thermally expandable fireproof material and fireproof compact in which fireproof processing is simple and it is hard to be lost even if exposed to hot air.SOLUTION: A thermally expandable fireproof material M is disclosed in which the thermoplastic resin and thermally expandable graphite are kneaded as a main component. The thermally expandable fireproof material M contains the thermally expandable graphite having an expansion start temperature Te of 135°C or less. Also, a melting point Tm of the thermoplastic resin contained in the thermally expandable fireproof material M as the main component satisfies 0°C
【課題】 耐火処理が簡単であり、高温の空気に曝されても喪失しにくい熱膨張性耐火材料や耐火成形体を提供する。【解決手段】 熱可塑性樹脂と熱膨張性黒鉛を主成分として混練された熱膨張性耐火材料Ｍが開示される。熱膨張性耐火材料Ｍは、膨張開始温度Ｔｅが１３５℃以下の熱膨張性黒鉛を含む。また、熱膨張性耐火材料Ｍに主成分として含まれる熱可塑性樹脂の融点Ｔｍは、０℃＜Ｔｅ−Ｔｍ≦３５℃を満たす。熱膨張性耐火材料Ｍを筒状もしくは板状に成形して耐火成形体１とできる。【選択図】 図１
THERMALLY EXPANDABLE FIREPROOF MATERIAL AND FIREPROOF COMPACT
To provide a thermally expandable fireproof material and fireproof compact in which fireproof processing is simple and it is hard to be lost even if exposed to hot air.SOLUTION: A thermally expandable fireproof material M is disclosed in which the thermoplastic resin and thermally expandable graphite are kneaded as a main component. The thermally expandable fireproof material M contains the thermally expandable graphite having an expansion start temperature Te of 135°C or less. Also, a melting point Tm of the thermoplastic resin contained in the thermally expandable fireproof material M as the main component satisfies 0°C
【課題】 耐火処理が簡単であり、高温の空気に曝されても喪失しにくい熱膨張性耐火材料や耐火成形体を提供する。【解決手段】 熱可塑性樹脂と熱膨張性黒鉛を主成分として混練された熱膨張性耐火材料Ｍが開示される。熱膨張性耐火材料Ｍは、膨張開始温度Ｔｅが１３５℃以下の熱膨張性黒鉛を含む。また、熱膨張性耐火材料Ｍに主成分として含まれる熱可塑性樹脂の融点Ｔｍは、０℃＜Ｔｅ−Ｔｍ≦３５℃を満たす。熱膨張性耐火材料Ｍを筒状もしくは板状に成形して耐火成形体１とできる。【選択図】 図１
THERMALLY EXPANDABLE FIREPROOF MATERIAL AND FIREPROOF COMPACT
熱膨張性耐火材料および耐火成形体
EGUSA FUMINORI (author) / SHIMA TSUGUNORI (author)
2019-12-19
Patent
Electronic Resource
Japanese